8 Layer 2nd Order HDI OSP Black Solder Mask PCB Via ≤25μM Registration Control
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
8-Layer 2nd-Order HDI OSP Black Solder Mask PCB Board with Stacked Laser Via ≤25μm Registration Control
This 8-layer 2nd-order HDI (High-Density Interconnect) PCB features OSP (Organic Solderability Preservative) surface finish with black oil solder mask, designed for advanced electronic applications demanding ultra-fine stacked via interconnects. The 2+N+2 stack-up structure with two-stage laser drilling achieves reliable L1-L2 and L1-L3 connections through precise stacked via alignment. Specialized process control for black solder mask exposure and developing ensures consistent imaging quality despite the low light transmittance of black oil.
Key Specifications
| Layer Count | 8-Layer |
| Material | FR4 |
| Board Thickness | 1.2mm (Customizable) |
| Copper Thickness | 1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Black Oil |
| Surface Finish | OSP |
Product Description
- Stacked Laser Via Alignment: Two-stage laser drilling process: first stage to L2, second stage to L3. Cumulative offset controlled within ≤25μm. Cross-section measurement of via center distance performed every shift for continuous process monitoring.
- Black Solder Mask Optimization: Exposure energy increased by 6-10% versus green oil to compensate for low light transmittance. Developing point narrowed by 15 seconds compared to green oil, effectively preventing residue and ensuring clean via openings.
- OSP Film Thickness Control: OSP coating thickness precisely maintained at 0.2-0.4μm with micro-etch rate controlled at 1.0-1.5μm/min, ensuring uniform film coverage and optimal solderability.
- 24-Hour Soldering Window: Boards must be soldered within 24 hours after vacuum packaging is opened. Beyond this window, solderability degradation may occur due to OSP film oxidation.
- Black Oil Residue Prevention: Enhanced developing parameters prevent black oil residue inside vias, which is critical for uniform OSP coating. Residue-free surface ensures consistent OSP film formation across all copper pads.
- 2nd-Order HDI Stack-Up: 2+N+2 construction with blind vias connecting L1-L2, L1-L3, L6-L8, and L5-L8, enabling maximum routing density for complex high-speed digital designs.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia