2.0mm Multilayer HDI PCB Board Assembly With Green Solder Mask
10-layer, three-stage OSP (Optical Sealant Propagation) green solder mask board, featuring a combination of laser-drilled vias and mechanically drilled through-holes, with strict control over drill residue removal and OSP uniformity. Mechanically drilled through-hole burrs are ≤8μm, and overlapping areas with blind vias undergo two rounds of adhesive removal. UV strengthening is applied after green solder mask development to enhance surface hardness. Micro-etching of the copper surface before OSP film application achieves a uniform pink appearance, with a film thickness of 0.25-0.4μm. Four simulated reflow soldering cycles are performed, with a wetting angle ≤25° and no film cracking. Ion contamination testing is conducted on each batch.
| Layer Count | 10-Layer |
| Material | FR4 |
| Board Thickness | 2mm (Customizable) |
| Copper Thickness | 1/0.5/0.5/0.5/0.5/0.5/0.5/0.5/0.5/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | Immersion Gold (ENIG) |
Product Description
- 10-Layer High-Density Interconnect (HDI) Design
Advanced 10-layer HDI PCB structure provides higher routing density, improved signal integrity, and enhanced electrical performance for complex electronic applications. - 2.0mm Board Thickness for Enhanced Stability
The 2.0mm thick PCB offers superior mechanical strength, durability, and resistance to warping, making it suitable for industrial and high-reliability devices. - Green Solder Mask Protection
High-quality green solder mask improves insulation performance, protects copper traces from oxidation, and enhances PCB durability during assembly and operation. - Fine Line and Microvia Technology
Supports laser-drilled microvias, blind vias, and buried vias, enabling compact circuit layouts and high-density component placement. - Excellent Signal Integrity
Optimized multilayer stack-up minimizes electromagnetic interference (EMI) and crosstalk, ensuring stable high-speed signal transmission. - High Precision PCB Assembly Service
Compatible with advanced SMT and THT assembly processes, supporting fine-pitch ICs, BGA packages, and complex electronic components. - Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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