High Density 8 Layer 2+N+2 HDI PCB Manufacturing Process With Black Solder Resist OSP Coating
Custom 8 Layer 2+N+2 HDI PCB with Black Solder Mask and OSP Finish is engineered for high-density, miniaturized electronic devices that demand superior routing capability, precise interconnection, and reliable solderability. The board utilizes advanced two-step HDI technology with stacked laser microvias, enabling higher circuit density and optimized signal transmission for complex electronic designs.
| Layer Count | 8-Layer |
| Material | FR-4 TG150 |
| Board Thickness | 1.2 mm (Customizable) |
| Copper Thickness | 2/1/1/1/1/1/1/2 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.075 mm |
| Minimum Line Spacing | 0.075 mm |
| Solder Mask Color | Black |
| Surface Finish | Immersion Gold (ENIG) |
Product Description
Advanced 8-layer HDI multilayer circuit board customization, supporting 1st-order, 2nd-order and stacked microvia structures to realize ultra-compact PCB layout for miniaturized electronic products.
Precision micro-processing capability: capable of ultra-fine line width/space, tiny microvias and ultra-thin finished board thickness with strict dimensional tolerance control.
Multiple customizable surface finishes available, including ENIG, OSP, HASL, Immersion Silver and Hard Gold to match different soldering, conductivity and anti-corrosion requirements.
Strict impedance control, high-speed signal integrity optimization and reliable thermal performance design for high-frequency, high-power industrial and consumer electronic equipment.
Full one-stop OEM service covering DFM design review, prototype sampling, small batch trial run and large-scale mass production.
Complete quality inspection system: AOI, AXI, electrical continuity test, thermal cycling test and reliability aging test to guarantee long-term stable product performance.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Get in Touch
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