14 Layer One Stop HDI PCB Board With ENIG Surface Finish Black Solder Mask
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
14 Layer 1-Step HDI PCB Board with ENIG Surface Finish and Black Solder Mask
Custom 14 Layer 1+N+1 HDI PCB with Black Solder Mask and ENIG Finish is designed for high-speed, high-density, and mission-critical electronic applications requiring exceptional layer registration accuracy, electrical performance, and long-term reliability. Combining a complex 14-layer stack-up with first-order HDI technology, this PCB provides an optimal balance between routing capability and manufacturing stability.
Key Specifications
| Layer Count | 14-Layer |
| Material | FR-4 TG170 |
| Board Thickness | 1.2 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1/1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Black |
| Surface Finish | Immersion Gold (ENIG) |
Product Description
14-Layer High-Density PCB Structure
- Advanced 14-layer stack-up design for complex routing requirements.
- Supports high-speed signal transmission and dense component placement.
- Suitable for sophisticated electronic systems.
Precision Lamination Registration Control
- Fourteen core layers aligned with registration deviation ≤50μm.
- Prevents blind-via and inner-layer target misalignment.
- Ensures consistent electrical connectivity throughout the PCB.
First-Order HDI Technology (1+N+1)
- Efficient blind-via interconnection structure.
- Improves routing density without excessive manufacturing complexity.
- Cost-effective solution for high-layer-count PCB designs.
Black Solder Mask Technology
- Premium appearance for high-end electronic products.
- Enhanced process control for fine-pitch circuitry.
- Suitable for compact and aesthetically demanding applications.
Enhanced AOI Inspection System
- UV-assisted optical inspection improves defect recognition.
- Reduces false detection caused by low-contrast black solder mask surfaces.
- Increases production quality and yield.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia