High Reliability Medical Circuit Board With OSP Coating Blue Solder Resist
A medical-grade low-temperature OSP (Organic Solderability Preservative) coating is applied with a controlled thickness of 0.25–0.40μm. Micro-etching is maintained between 0.7–1.1μm, while copper surface water-break testing exceeds 35 seconds, ensuring optimal coating adhesion and uniformity. After five simulated reflow cycles, the wetting angle remains ≤20°, demonstrating excellent solderability.
The blue solder mask undergoes complete development verification and achieves a 5B adhesion rating through cross-hatch testing. Following post-curing at 150°C for 65 minutes, the PCB exhibits excellent insulation and environmental resistance.
| Layer Count | 4-Layer |
| Material | FR-4 TG170 |
| Board Thickness | 1.2 mm (Customizable) |
| Copper Thickness | 2/1/1/2 oz |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Width | 0.12 mm |
| Minimum Line Spacing | 0.12 mm |
| Solder Mask Color | Blue |
| Surface Finish | OSP |
Product Description
Medical-Grade 4-Layer PCB Construction
- Designed for medical electronics and healthcare equipment.
- High reliability multilayer PCB architecture.
- Suitable for critical medical applications.
Precision Inner-Layer Circuit Fabrication
- Line width tolerance controlled within ±7μm.
- Etching factor ≥4 for improved conductor definition.
- Enhanced signal consistency and circuit reliability.
100% AOI Inspection
- Full Automated Optical Inspection of all inner layers.
- No open circuits permitted before lamination.
- Improves production yield and product quality.
Advanced Vacuum Lamination Process
- Vacuum level controlled at ≤-0.098 MPa.
- 20-minute pre-press process eliminates voids.
- Prevents delamination and internal defects.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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