Custom 6 Layer Medical PCB Manufacturing With Black Solder Mask Through Hole Technology
Medical-grade 6-layer through-hole solder-free black solder paste board, with strict control over the uniformity of the solder layer, the integrity of the black solder paste coverage, and medical-grade cleanliness. Drilling process burrs ≤10μm, hole wall roughness ≤20μm, backlight ≥9 level. Before soldering, low flux residue verification is performed, ion residue ≤0.1μg/cm², vertical soldering line speed 1.0m/min, air knife pressure 0.4-0.6MPa, solder thickness 2-6μm, ≥2μm at leads, no exposed copper, no icicles, and no solder nodules inside the holes. Black solder paste requires two screen printings, thickness ≥20μm, exposure energy 12-15% higher than green solder paste, development point controlled at 40-46 seconds, full inspection of pinholes under UV light, post-curing stepped temperature rise of 80→120→150℃ for 30 minutes each for explosion-proof holes. After thermal stress of 288℃×10s, no bubbling or cracking of the black solder paste, and the copper elongation of the holes ≥12%. Ion contamination ≤0.3μg/cm², solderability test for each batch with a solderability rate ≥98%, and medical-specific traceability code engraved on the entire board.
| Layer Count | 6-Layer |
| Material | FR-4 |
| Board Thickness | 1.6 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Width | 0.15 mm |
| Minimum Line Spacing | 0.15 mm |
| Solder Mask Color | Black |
| Surface Finish | Lead-free soldering |
Product Description
Medical-Grade 6-Layer PCB Construction
- Designed for medical electronics and healthcare devices.
- High-reliability multilayer PCB architecture.
- Suitable for long-life and mission-critical applications.
Precision Through-Hole Drilling Technology
- Burr height controlled within ≤10μm.
- Hole wall roughness maintained at ≤20μm.
- Improves plated-hole reliability and copper adhesion.
Superior Desmear and Hole Quality
- Backlight inspection grade ≥9.
- Complete removal of drilling residues.
- Ensures consistent metallization performance.
Lead-Free HASL Surface Finish
- RoHS-compliant lead-free hot air solder leveling process.
- Excellent solderability and assembly performance.
- Cost-effective and durable surface protection.
Uniform Solder Coating Control
- HASL thickness maintained at 2–6μm.
- Minimum solder coverage ≥2μm on lead areas.
- Consistent solderability across the PCB surface.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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