1.5oz Rogers RF High Frequency PCB Board Fabrication 8 Layer Customized
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
1.5oz Rogers RF High Frequency PCB Board 8 Layer Fabrication Customized
1.5oz Rogers RF High Frequency PCB Board 8 Layer Fabrication Customized is a premium multilayer PCB solution engineered for RF, microwave, millimeter-wave, aerospace, defense, satellite communication, and 5G networking applications. Utilizing high-performance Rogers® high-frequency materials combined with a robust 8-layer stack-up and 1.5oz copper thickness, this PCB delivers exceptional signal integrity, low insertion loss, controlled impedance, and superior thermal stability in demanding high-frequency environments.
Key Specifications
| Layer Count | 8-Layer |
| Material | Rogers |
| Board Thickness | 1.5 mm (Customizable) |
| Copper Thickness | 1.5/1/1/1/1/1/1/1.5 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
Premium Rogers High-Frequency Material
- Low dielectric constant (Dk) for stable RF performance.
- Ultra-low dissipation factor (Df) minimizes signal loss.
- Excellent electrical stability across wide frequency ranges.
Advanced 8-Layer PCB Structure
- Supports complex RF and high-speed digital circuits.
- Enhanced routing density and signal isolation.
- Optimized power and ground plane design.
1.5oz Heavy Copper Construction
- Improved current-carrying capability.
- Enhanced thermal management performance.
- Increased mechanical durability and reliability.
Superior Signal Integrity
- Reduced insertion loss and signal attenuation.
- Excellent phase stability for RF applications.
- Supports high-frequency and high-speed data transmission.
Precision Controlled Impedance
- Tight impedance tolerance control.
- Consistent transmission line performance.
- Suitable for RF antennas, microwave modules, and communication systems.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia