Shenzhen Xunsiwei Circuit Co., Ltd.
                                                                                                           
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ISOLA 370HR High Frequency Printed Circuit Board Manufacturing And Assembly 1.5mm

Price Negotiable
Price: Negotiable
MOQ: 1
Delivery Time: 8-15DAYS
Brand: XSW PCB
Product Description

ISOLA 370HR High Frequency PCB Manufacturing And Assembly 1.5mm

 

ISOLA 370HR High Frequency PCB Manufacturing and Assembly 1.5mm is a high-performance multilayer PCB solution designed for high-speed digital, RF communication, networking, industrial control, automotive electronics, and advanced computing applications. Built with premium ISOLA 370HR high-performance laminate material, this PCB offers exceptional thermal reliability, low loss characteristics, superior CAF resistance, and outstanding electrical performance for demanding electronic systems.

 

Key Specifications
Layer Count 8-Layer
Material ISOLA 370HR
Board Thickness 1.5 mm (Customizable)
Copper Thickness 1.5/1/1/1/1/1/1/1.5 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish   ENIG

 

Product Description

Premium ISOLA 370HR Material

  • High-performance laminate designed for reliability-critical applications.
  • Tg value of approximately 180°C.
  • Excellent thermal and mechanical stability.

High-Speed Signal Performance

  • Optimized for high-speed digital and communication circuits.
  • Reduced signal loss and transmission distortion.
  • Suitable for controlled impedance applications.

Low Loss Electrical Characteristics

  • Stable dielectric constant across operating frequencies.
  • Low dissipation factor for improved signal integrity.
  • Supports high-frequency and high-speed designs.

1.5mm Standard PCB Thickness

  • Excellent mechanical strength and dimensional stability.
  • Compatible with a wide range of electronic assemblies.
  • Suitable for industrial and communication equipment.

Superior Thermal Reliability

  • Excellent resistance to thermal cycling.
  • Reduced risk of delamination under harsh operating conditions.
  • Suitable for lead-free assembly processes.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Xunsiwei Circuit Co., Ltd.
Location No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person xia

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