10 Layer Server PCB FR4 TG150 ENIG 2.0mm PCB Assembly Services
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
10 Layer FR4 TG150 ENIG 2.0mm PCBA Board for Server
10 Layer FR4 TG150 ENIG 2.0mm PCBA Board for Server is a high-reliability multilayer PCB assembly solution specifically designed for servers, data centers, storage systems, networking equipment, cloud computing infrastructure, and enterprise-class computing platforms. Built with 10-layer FR4 TG150 material, 2.0mm board thickness, and a premium ENIG (Electroless Nickel Immersion Gold) surface finish, this PCBA delivers excellent signal integrity, thermal stability, power distribution, and long-term operational reliability.
Key Specifications
| Layer Count | 10-Layer |
| Material | FR4 TG150 |
| Board Thickness | 2.0 mm (Customizable) |
| Copper Thickness | 2/1/1/1/1/1/1/1/1/2 oz |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Width | 0.2 mm |
| Minimum Line Spacing | 0.2 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
10-Layer High-Density PCB Design
- Advanced 10-layer stack-up for complex server architectures.
- Dedicated signal, power, and ground planes.
- Supports high-speed computing and networking applications.
FR4 TG150 High-Tg Material
- Glass transition temperature (Tg) of 150°C.
- Excellent thermal stability and dimensional control.
- Suitable for high-power and continuous-operation environments.
2.0mm Heavy-Duty Board Thickness
- Enhanced mechanical strength and rigidity.
- Improved resistance to warping and deformation.
- Ideal for large server motherboard applications.
Premium ENIG Surface Finish
- Excellent solderability and oxidation resistance.
- Flat surface for BGA, CPU, and memory device assembly.
- Improved long-term reliability of solder joints.
Superior Signal Integrity
- Optimized for high-speed server communication.
- Reduced signal loss, EMI, and crosstalk.
- Supports PCIe, DDR memory, Ethernet, and high-speed interfaces.
High Current Carrying Capability
- Optimized power plane design.
- Stable power delivery to processors and critical components.
- Suitable for high-performance computing systems.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia