Shenzhen Xunsiwei Circuit Co., Ltd.
                                                                                                           
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Polyimide Thick Copper Substrate PCB Multilayer PCB Fabrication Service ODM

Price Negotiable
Price: Negotiable
MOQ: 1
Delivery Time: 8-15DAYS
Brand: XSW PCB
Product Description

Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM

 

Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM is a high-performance PCB manufacturing solution designed for applications requiring exceptional thermal resistance, high current capacity, mechanical durability, and long-term reliability. Utilizing premium Polyimide (PI) substrate materials combined with thick copper technology, this multilayer PCB is ideal for power electronics, industrial automation, aerospace systems, electric vehicles, renewable energy equipment, and other mission-critical applications.

 

Key Specifications
Layer Count 14-Layer
Material Polyimide
Board Thickness 1.5 mm (Customizable)
Copper Thickness 4/2/2/2/2/2/2/2/2/2/2/2/2/4 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.25 mm
Minimum Line Spacing 0.25 mm
Solder Mask Color Green
Surface Finish   ENIG

 

Product Description

Premium Polyimide Substrate Material

  • Excellent thermal resistance and dimensional stability.
  • Superior performance in high-temperature environments.
  • Ideal for aerospace, automotive, and industrial applications.

Thick Copper Technology

  • Enhanced current-carrying capability.
  • Reduced conductor resistance and voltage drop.
  • Suitable for high-power electronic systems.

Multilayer PCB Construction

  • Supports complex circuit architectures.
  • Improved signal routing and power distribution.
  • High-density design capability.

Outstanding Thermal Management

  • Efficient heat dissipation for power-intensive applications.
  • Improved reliability under continuous operation.
  • Reduced thermal stress on components.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Xunsiwei Circuit Co., Ltd.
Location No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person xia

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