OEM 5G Communication Module Circuit Boards 12 Layer PCB Manufacturing Assembly
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
5G Communication Module Oem Circuit Boards PCB Assembly Processing
5G Communication Module OEM Circuit Boards PCB Assembly Processing is a high-performance PCB assembly solution specifically developed for 5G communication modules, wireless networking equipment, IoT devices, telecommunications infrastructure, and high-speed data transmission systems. Designed to meet the stringent requirements of modern 5G technology, this PCB assembly service delivers excellent signal integrity, controlled impedance, low transmission loss, and superior reliability for next-generation communication applications.
Key Specifications
| Layer Count | 12-Layer |
| Material | FR4 |
| Board Thickness | 2.5 mm (Customizable) |
| Copper Thickness | 2/1/1/1/1/1/1/1/1/1/1/2 oz |
| Minimum Hole Size | 0.25 mm |
| Minimum Line Width | 0.25 mm |
| Minimum Line Spacing | 0.25 mm |
| Solder Mask Color | Green |
| Surface Finish | Lead-free soldering |
Product Description
Designed for 5G Communication Applications
- Optimized for high-speed wireless communication systems.
- Supports 5G NR, LTE, Wi-Fi, and IoT communication technologies.
- Suitable for next-generation networking equipment.
High-Speed Signal Integrity
- Advanced PCB stack-up design for high-frequency signals.
- Reduced signal attenuation and transmission loss.
- Stable performance in high-bandwidth applications.
Controlled Impedance PCB Technology
- Precise impedance control for RF and high-speed circuits.
- Improved signal quality and transmission consistency.
- Essential for 5G communication modules.
Advanced Multilayer PCB Construction
- Supports complex high-density circuit designs.
- Enhanced power distribution and signal isolation.
- Suitable for compact communication devices.
High-Precision SMT Assembly
- Automated placement for fine-pitch components.
- Supports BGA, QFN, CSP, LGA, and RF packages.
- High assembly accuracy and production efficiency.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Get in Touch
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia