ODM Automotive PCB Assembly 6 Layer PCB Board Fabrication
ODM Automotive PCBA Assembly 6 Layer Board Fabrication
Automotive 6-layer through-hole immersion gold green solder mask, with strict control over interlayer misalignment and immersion gold layer stress. Interlayer misalignment ≤70μm, X-ray sampling inspection, warpage ≤0.5%. Drill burrs ≤10μm, hole wall roughness ≤20μm, backlight level ≥9. Plasma cleaning before immersion gold, gold thickness 0.05-0.10μm, nickel layer phosphorus content 8-11%, internal stress controlled at 80-120MPa. After green solder mask development, side etching ≤5μm, post-curing at 150℃×65min, insulation resistance ≥100MΩ. After thermal stress at 288℃×10s×3 times, through-hole copper elongation ≥12%, green solder mask blister-free. Ion contamination ≤0.6μg/cm², CAF testing for 500h per batch. Automotive-specific UL code engraved on board edges.
| Layer Count | 6-Layer |
| Material | FR-4 TG150 |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
Automotive-Grade 6-Layer PCB Structure
- Optimized 6-layer stack-up for automotive electronic systems.
- Dedicated signal, power, and ground layers improve circuit stability.
- Suitable for complex vehicle control and communication applications.
Automotive Electronics Reliability
- Designed to withstand demanding automotive operating environments.
- Excellent performance under temperature fluctuations, vibration, and humidity.
- Supports long-term operation in critical vehicle systems.
High-Density Circuit Integration
- Enables compact and complex automotive electronic designs.
- Supports advanced ECUs, sensors, and communication modules.
- Improves system functionality while reducing board size.
Advanced SMT & THT Assembly
- Supports Surface Mount Technology (SMT) and Through-Hole Technology (THT).
- Compatible with BGA, QFN, LGA, CSP, and fine-pitch components.
- Ensures accurate component placement and assembly quality.
Excellent Signal Integrity
- Optimized multilayer routing reduces signal interference.
- Minimizes EMI and crosstalk between circuits.
- Suitable for high-speed automotive communication networks.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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