3mm Thickness FR4 4 Layer Server PCB Circuit Board For 5G Base Station
FR4 3mm Thickness 4-Layer Server PCB Board for 5G Base Station with 2OZ Copper and 0.3mm Min Hole Size
The FR4 3mm Thickness 4-Layer Server PCB Board is designed for high-performance server systems, 5G base station equipment, data communication infrastructure, and industrial networking applications. Manufactured using premium FR4 laminate material, this multilayer PCB features a robust 3.0mm board thickness, 2OZ heavy copper, and a minimum hole size of 0.3mm, providing excellent electrical performance, mechanical strength, and thermal stability.
Engineered to support high-speed signal transmission and high-current power delivery, this 4-layer PCB board ensures reliable operation in demanding telecommunications and data center environments. Advanced PCB fabrication processes enable precise impedance control, superior signal integrity, and stable performance for mission-critical networking and server hardware.
| Layer Count | 4-Layer |
| Material | FR4 |
| Board Thickness | 3.0 mm (Customizable) |
| Copper Thickness | 2/2/2/2 oz |
| Minimum Hole Size | 0.3 mm |
| Minimum Line Width | 0.25 mm |
| Minimum Line Spacing | 0.25 mm |
| Solder Mask Color | Black |
| Surface Finish | ENIG |
Product Description
- 4-Layer Multilayer PCB Structure
- Optimized layer stack-up for high-speed digital signals and power distribution.
- Improves EMI suppression and signal integrity.
- 3.0mm Heavy-Duty Board Thickness
- Enhanced mechanical strength and rigidity.
- Suitable for large-format server and telecom equipment.
- 2OZ Heavy Copper Circuitry
- Supports higher current loads and improved thermal performance.
- Reduces voltage drop and power loss in high-power applications.
- 0.3mm Minimum Hole Size
- High-precision drilling technology enables dense component placement.
- Supports complex server and communication board designs.
- Premium FR4 Material
- Excellent electrical insulation and dimensional stability.
- Reliable performance under continuous operation.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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