12 Layers Server Communication PCB For Fast Secure Data Processing And Storage
12 Layers Server Communication PCB For Fast Secure Data Processing And Storage
The 12 Layers Server Communication PCB is engineered for high-speed data processing, secure communication, and large-scale data storage applications. Designed with a complex multilayer stack-up, this PCB provides exceptional signal integrity, power distribution efficiency, and electromagnetic interference (EMI) suppression required by modern servers, data centers, cloud computing platforms, and communication equipment.
Manufactured using high-quality low-loss materials and advanced PCB fabrication technology, the board supports high-frequency signal transmission, high-density component integration, and reliable long-term operation. Its 12-layer architecture enables optimized routing for high-speed interfaces, ensuring stable performance in mission-critical networking, storage, and enterprise computing environments.
| Layer Count | 12-Layer |
| Material | FR4 |
| Board Thickness | 1.6 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.25 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
- 12-Layer High-Density Design
- Provides ample routing space for complex server and communication circuits.
- Supports high-density component placement and advanced processor architectures.
- High-Speed Signal Integrity
- Optimized stack-up structure minimizes signal loss, crosstalk, and transmission delays.
- Suitable for high-speed networking and data communication protocols.
- Fast Data Processing Capability
- Designed to support multi-core processors, memory modules, and high-bandwidth interfaces.
- Enables efficient data transfer within server and storage systems.
- Enhanced Data Security and Reliability
- Stable power distribution and signal routing help ensure secure and uninterrupted system operation.
- Reduces communication errors in critical applications.
- Excellent EMI and EMC Performance
- Multiple ground and power planes improve electromagnetic compatibility.
- Minimizes interference in high-frequency environments.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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