5G High Speed PCB Design Server Communication Electronic Equipment PCB
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
5G Printed Circuit Board Server Communication Electronic Equipment PCB High Speed
The 5G Printed Circuit Board (PCB) for Server Communication Electronic Equipment is specifically designed to meet the demanding requirements of high-speed data transmission, cloud computing, telecommunications infrastructure, and next-generation 5G networks. Built with advanced multilayer PCB technology and high-performance low-loss materials, this PCB delivers exceptional signal integrity, stable power distribution, and superior electromagnetic compatibility.
Key Specifications
| Layer Count | 6-Layer |
| Material | FR4 |
| Board Thickness | 1.6 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.25 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
- High-Speed Data Processing
- Designed to handle large volumes of data with minimal latency.
- Supports advanced server and networking architectures.
- Excellent Signal Integrity
- Controlled impedance design minimizes signal loss and crosstalk.
- Ensures reliable performance for high-speed communication protocols.
- Multilayer PCB Construction
- Provides dedicated power and ground planes for stable signal routing.
- Supports complex circuit designs and dense component placement.
- Low-Loss Material Compatibility
- Available with high-frequency materials for superior transmission performance.
- Ideal for RF and microwave communication applications.
- Superior EMI/EMC Performance
- Advanced layer stack-up reduces electromagnetic interference.
- Enhances communication stability in high-density electronic systems.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia