Multilayer Automotive Printed Circuit Board High Frequency Hybrid PCB Board
Multilayer High Frequency Hybrid PCB Board For Aviation Automotive Machinery Industry
The Multilayer High Frequency Hybrid PCB Board is designed for demanding applications in the aviation, automotive, industrial machinery, and advanced communication industries. Combining high-frequency materials with conventional FR4 substrates, this hybrid PCB structure delivers an optimal balance of signal performance, mechanical strength, thermal stability, and cost efficiency.
Manufactured using advanced multilayer PCB technology, the board supports high-speed signal transmission, RF circuits, power management systems, and complex electronic assemblies. The hybrid material construction minimizes signal loss while maintaining excellent structural reliability, making it ideal for mission-critical systems operating in harsh environments.
| Layer Count | 8-Layer |
| Material | Rogers, Teflon, PTFE |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.25 mm |
| Minimum Line Width | 0.12 mm |
| Minimum Line Spacing | 0.076 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG, HASL, OSP, Immersion Silve |
Product Description
- Hybrid Material Construction
- Combines high-frequency laminates with FR4 materials for optimized performance and cost control.
- Suitable for mixed-signal, RF, and high-speed digital applications.
- Excellent High-Frequency Performance
- Low dielectric loss supports stable RF and microwave signal transmission.
- Reduces insertion loss and signal attenuation.
- Multilayer PCB Design
- Supports complex circuit routing and high-density component placement.
- Improves power distribution and signal integrity.
- Superior Signal Integrity
- Controlled impedance routing minimizes crosstalk and electromagnetic interference.
- Ensures reliable operation in high-speed electronic systems.
- High Thermal Stability
- Maintains electrical performance under elevated temperatures and continuous operation.
- Suitable for harsh industrial and automotive environments.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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