8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB Manufacturer
5G Optical Module PCB Optical Transceiver PCB High-Frequency PCB Manufacturer
This 5G optical module features an 8-layer through-hole immersion gold plating with green solder mask, controlling glass cloth protrusion on the hole walls and preventing solder bridges from the green solder mask. Drilling employs a double-sided drilling process, ensuring no glass cloth protrusion on the hole walls, a roughness ≤10μm, and a backlight rating ≥9. The width of the green solder mask is ≥75μm, measured using 3D measurement after development, and then cured at 150℃ for 70min. Plasma cleaning is performed before immersion gold plating, resulting in a gold thickness of 0.05-0.10μm, no black pads in the nickel layer, and a salt spray test duration ≥96h. Ultrasonic scanning after thermal shock shows no delamination, and the copper elongation within the holes is ≥12%. Ion contamination is ≤0.3μg/cm², and each batch undergoes a 1000h CAF test for insulation resistance ≥10^9Ω. A dedicated 5G optical module QR code is laser-engraved on the board surface.
| Layer Count | 8-Layer |
| Material | FR-4 TG150 |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.15 mm |
| Minimum Line Width | 0.075 mm |
| Minimum Line Spacing | 0.075 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
- High-Reliability 8-Layer PCB Structure
- Designed for 5G optical communication modules requiring high-speed signal transmission and long-term operational stability.
- Multilayer stack-up enhances signal integrity and power distribution performance.
- Advanced Through-Hole Quality Control
- Double-sided drilling process effectively eliminates glass fiber protrusion on hole walls.
- Hole wall roughness controlled to ≤10μm, improving plating uniformity and electrical reliability.
- Backlight inspection rating reaches ≥9, ensuring excellent drilling quality.
- Optimized Green Solder Mask Process
- Green solder mask bridge width controlled at ≥75μm through 3D measurement verification after development.
- Prevents solder bridging and improves assembly yield for fine-pitch components.
- High-temperature curing at 150℃ for 70 minutes enhances adhesion and chemical resistance.
- Premium ENIG Surface Finish
- Plasma cleaning before immersion gold plating improves surface cleanliness and coating adhesion.
- Gold thickness maintained at 0.05–0.10μm for excellent solderability and contact performance.
- No black pad defects in the nickel layer, ensuring high reliability for optical module applications.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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