Custom 6 Layer ENIG PCB For 5G Optical Modules With High Precision Registration
6-Layer ENIG PCB for 5G Optical Modules with High-Precision Registration
5G optical module 6-layer through-hole immersion gold and green solder mask board, with controlled interlayer misalignment and immersion gold layer stress. Interlayer misalignment ≤50μm, X-ray sampling inspection, warpage ≤0.3%. Drill burrs ≤5μm, hole wall roughness ≤12μm, backlight ≥9 level. Plasma cleaning before immersion gold, gold thickness 0.05-0.10μm, nickel layer phosphorus content 8-11%, internal stress controlled at 80-100MPa. After green solder mask development, side etching ≤4μm, post-curing at 150℃×65min, insulation resistance ≥100MΩ. After thermal stress at 288℃×10s×3 times, through-hole copper elongation ≥12%, green solder mask no bubbling. Ion contamination ≤0.3μg/cm², CAF testing 1000h for each batch. 5G optical module-specific UL code is engraved on the board edge.
| Layer Count | 6-Layer |
| Material | FR-4 TG170 |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
- Designed for 5G Optical Communication Modules
- Optimized for high-speed optical transceivers, optical network equipment, data center communication systems, and telecom infrastructure.
- Supports stable high-frequency signal transmission and long-term operational reliability.
- High-Precision 6-Layer PCB Construction
- Interlayer registration controlled to ≤50μm for accurate multilayer alignment.
- X-ray sampling inspection ensures consistent manufacturing quality.
- Board warpage maintained at ≤0.3%, improving assembly accuracy and component reliability.
- Superior Drilling Quality
- Drill burrs controlled to ≤5μm for clean hole edges.
- Hole wall roughness maintained at ≤12μm, enhancing copper plating adhesion.
- Backlight inspection rating reaches ≥9, ensuring excellent through-hole quality.
- Premium ENIG Surface Finish
- Plasma cleaning process performed before immersion gold plating to improve coating adhesion and surface cleanliness.
- Gold thickness controlled at 0.05–0.10μm for excellent solderability and contact performance.
- Nickel layer phosphorus content maintained at 8–11%, ensuring stable metallurgical properties.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.