Customizable 5G Optical Module PCB FR4 TG170 8 Layer PCB Manufacturer
Customizable 5G Optical Module PCB 8-Layer FR4-Tg 170
The Customizable 5G Optical Module PCB 8-Layer FR4-Tg 170 is designed for high-speed optical communication systems, 5G network infrastructure, data centers, and optical transceiver applications. Manufactured with high-performance FR4-Tg 170 material, this multilayer PCB offers excellent thermal stability, dimensional consistency, and electrical reliability under demanding operating conditions.
The 8-layer stack-up structure provides optimized signal routing, controlled impedance, and enhanced electromagnetic compatibility, making it ideal for high-frequency and high-bandwidth applications. Engineered to support advanced optical modules and communication equipment, the PCB ensures low signal loss, stable data transmission, and long-term reliability.
| Layer Count | 8-Layer |
| Material | FR-4 TG170 |
| Board Thickness | 0.8 mm (Customizable) |
| Copper Thickness | 1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.075 mm |
| Minimum Line Spacing | 0.075 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
- Optimized for 5G Optical Modules
- Designed for high-speed optical transceivers and optical communication equipment.
- Supports data rates required for next-generation 5G and data center applications.
- Advanced 8-Layer PCB Structure
- Provides dedicated signal, power, and ground layers for enhanced performance.
- Improves signal routing efficiency and power integrity.
- Excellent Signal Integrity
- Controlled impedance routing minimizes signal loss and reflection.
- Supports high-speed differential pair transmission and low-latency communication.
- Low-Loss Material Compatibility
- Available with high-frequency and low-Dk materials for superior electrical performance.
- Reduces insertion loss in high-speed optical networking applications.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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