2 Layer Radio Frequency PCB On Rogers 30 Mil (0.762mm) RO4350B For I/O Amplifier
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
Radio Frequency PCB On Rogers 30 mil(0.762mm) RO4350B With Immersion Gold for I/O Amplifier
RF PCB On 30 mil(0.762mm) RO4350B With Immersion Gold(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference) General descriptionThis is a type of RF PCB built on 30mil RO4350B substrate with Tg 280°C for the application of Wireless Communication. It's 0.80 mm thick with 2 layers copper, white silkscreen over green solder mask and immersion gold are on pads.
Key Specifications
| Layer Count | 2-Layer |
| Material | Rogers |
| Board Thickness | 0.8 mm (Customizable) |
| Copper Thickness | 1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
- Optimized for RF I/O Amplifier Applications
- Designed for RF input/output amplifiers, power amplifiers, low-noise amplifiers (LNA), RF front-end modules, and wireless communication equipment.
- Suitable for 5G infrastructure, satellite communication, radar systems, and RF test instruments.
- Excellent High-Frequency Signal Integrity
- Low-loss substrate minimizes insertion loss and signal attenuation.
- Controlled impedance routing improves transmission accuracy and reduces signal reflection.
- Immersion Gold (ENIG) Surface Finish
- Provides outstanding solderability and flat pad surfaces for fine-pitch SMT components.
- Offers excellent corrosion resistance and reliable electrical contact for RF applications.
- Superior Thermal Stability
- High thermal stability with Tg above 280°C supports lead-free soldering and continuous high-power operation.
- Low Z-axis coefficient of thermal expansion improves plated through-hole reliability during thermal cycling.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia