Immersion Gold PCB Multilayer Microwave RF Communication PCB Board
Price:
Negotiable
MOQ:
1
Delivery Time:
8-15DAYS
Brand:
XSW PCB
Product Description
Immersion Gold PCB Multilayer PCB Circuit Microwave Radio Frequency Communication Board
The Immersion Gold Multilayer PCB Circuit Board is specifically designed for microwave, radio frequency (RF), and high-speed communication applications. Manufactured using advanced multilayer PCB technology and premium high-frequency materials, this board delivers excellent signal integrity, low transmission loss, and superior electromagnetic compatibility for demanding wireless communication systems.
Key Specifications
| Layer Count | 4-Layer |
| Material | FR4 |
| Board Thickness | 1.2 mm (Customizable) |
| Copper Thickness | 1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
- Optimized for Microwave & RF Applications
- Designed for high-frequency signal transmission and microwave communication systems.
- Suitable for RF circuits operating in demanding communication environments.
- Multilayer PCB Construction
- Supports complex signal routing and high-density circuit layouts.
- Dedicated power and ground planes improve signal stability and EMI suppression.
- ENIG (Immersion Gold) Surface Finish
- Provides excellent solderability and flat surface characteristics.
- Enhances corrosion resistance and long-term electrical reliability.
- Excellent Signal Integrity
- Controlled impedance design minimizes signal reflection and transmission loss.
- Supports high-speed and high-frequency communication protocols.
- Low Insertion Loss
- High-frequency material options reduce attenuation in RF and microwave circuits.
- Improves overall communication efficiency.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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Company
Shenzhen Xunsiwei Circuit Co., Ltd.
Location
No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person
xia