1 Layer Copper Substrate PCB PCBA Service 0.8mm High Thermal Conductivity
PCB PCBA Service High Thermal Conductivity Copper Substrate PCB
High Thermal Conductivity Copper Substrate PCB is a professional metal core printed circuit board (MCPCB) customized for high-power heat dissipation scenarios. It adopts high-performance copper base as the core heat-conducting substrate, combined with reliable circuit fabrication, surface finishing and assembly processes to provide integrated PCB & PCBA one-stop services. This copper base PCB efficiently transfers heat generated by power chips, LEDs and power components outward, effectively solving overheating failures of high-power electronic equipment, widely applied in new energy, automotive electronics, high-power lighting, power supply and industrial control fields. Our full PCBA service covers PCB manufacturing, component procurement, SMT soldering, DIP assembly, function testing and finished product packaging, delivering ready-to-use circuit assemblies to customers.
| Layer Count | 1-Layer |
| Material | Copper |
| Board Thickness | 0.8 mm (Customizable) |
| Copper Thickness | 1 oz |
| Minimum Hole Size | 0.15 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | White |
| Surface Finish | ENIG |
Product Description
- High Power Handling Capability
- Supports high-current and high-power applications.
- Ideal for power conversion, motor control, and industrial electronic systems.
- Enhanced Reliability
- Efficient thermal management minimizes thermal stress on components.
- Improves product lifespan and long-term operational stability.
- Superior Mechanical Strength
- Copper core structure offers excellent rigidity and durability.
- Resistant to vibration, shock, and harsh operating environments.
- Optimized Thermal Management Design
- Reduces hot spots and improves heat distribution across the PCB.
- Suitable for applications requiring continuous high-load operation.
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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