Shenzhen Xunsiwei Circuit Co., Ltd.
                                                                                                           
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Polyimide Double Layer Printed Circuit Board 0.4mm Thickness Flexible Printed Circuit FPC

Price Negotiable
Price: Negotiable
MOQ: 1
Delivery Time: 8-15DAYS
Brand: XSW PCB
Product Description

 

High Quality Polyimide Material Flexible PCB Double Layer Flex PCB FPC

 

This is a double‑layer flexible printed circuit (FPC) manufactured using high‑quality polyimide (PI) as the base material. It features excellent flexibility, bending resistance, high temperature resistance and stable electrical performance. The double‑layer structure provides stronger wiring capability and higher integration, making it ideal for compact, dynamic and space‑limited electronic applications such as connectors, displays, wearable devices, cameras and miniaturized modules.

 

Key Specifications
Layer Count 2-Layer
Material Polyimide (PI)
Board Thickness 0.4 mm (Customizable)
Copper Thickness 0.5/0.5 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Red
Surface Finish   OSP

 

Product Description

High‑Grade Polyimide (PI) Substrate
Superior heat resistance, chemical resistance, insulation and mechanical stability for long‑term reliability.


Double Layer FPC Structure
Dual‑sided circuit design with through‑hole interconnection, higher wiring density and stronger functionality.


Excellent Flexibility & Bendability
Supports repeated bending, folding and torsion, ideal for 3D assembly and dynamic motion applications.


Lightweight & Ultra‑Thin
Thin, flexible and lightweight, greatly saving space and reducing overall device weight.
High Temperature Resistance


Stable performance under high‑temperature soldering and operating conditions.
High Precision & Good Signal Integrity


Fine line capability, low impedance loss, suitable for high‑resolution and high‑speed signal transmission.


Wide Application
Widely used in consumer electronics, wearables, automotive, medical, camera and display modules.

  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Xunsiwei Circuit Co., Ltd.
Location No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
Contact Person xia

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