OSP Single Layer Printed Circuit Board FR-4 White Solder Mask PCB For Display Backlight
Single Layer Printed Circuit Board with White Solder Mask 0.2mm FR-4 PCB Board with OSP for Display Backlight
This single-layer FR-4 PCB features 0.2mm finished thickness, white solder mask and OSP surface finish, specially manufactured for display backlight driver assemblies. The lightweight thin FR4 substrate meets the ultra-thin structural requirements of backlight modules. White solder mask offers high reflectivity to improve light utilization efficiency of LED backlights. OSP treatment provides good solderability for LED chips and passive components with cost-effective advantages. Stable insulation performance and reliable circuit etching ensure consistent current transmission for backlight circuits. Widely used in LCD screens, tablet displays, monitor backlight strips, notebook panel backlight modules and small-size display lighting units.
| Layer Count | 1-Layer |
| Material | FR-4 |
| Board Thickness | 0.2 mm (Customizable) |
| Copper Thickness | 0.5 oz |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | White |
| Surface Finish | OSP |
Product Description
- Single layer PCB construction, finished board thickness: 0.2mm, ultra-thin and lightweight
- FR-4 base material, excellent electrical insulation and good dimensional stability
- White solder mask, high light reflectivity, enhance LED backlight luminous efficiency
- OSP organic solderability preservative surface treatment, economical and eco-friendly
- Precise circuit etching, uniform trace width for stable LED current output
- Flexible ultra-thin board design, suitable for narrow space backlight module assembly
- Good heat dissipation performance for low-power LED backlight circuits
- Low water absorption, stable performance in normal display working temperature
- Support customized circuit pattern, panel size and routing according to drawings
- Cost-effective solution for mass production of display backlight units
- Design Specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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