High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages

BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate redistributes fine-pitch die bumps (40-130 μm pitch) to the coarser BGA ball array (400-1000 μm pitch) that interfaces with the main PCB. Available in 2-12 layer configurations with core thicknesses of 40-200 μm, these substrates support FC-CSP package sizes from 3*3 mm to 19*19 mm with bump pitches down to 0.15 mm.

Mobile AP & Logic ICs

FC-CSP packages on BT substrates offer compact form factors (3*3 mm to 19*19 mm) with fine bump pitch (≥0.15 mm), ideal for space-constrained mobile devices.

RF Modules & Wireless Communication

BT's stable Dk (3.4-4.0) and low Df (0.004-0.010) at 1 GHz provide reliable signal integrity for RF front-end modules and wireless transceivers.

System-in-Package (SiP) Integration

Multi-chip modules benefit from BT's dimensional stability and fine-line capability, enabling high-density interconnect for complex system integration.

Automotive & Industrial Electronics

High Tg (180-225°C) and excellent moisture resistance make BT substrates suitable for automotive-grade MCUs and industrial control applications requiring extended temperature cycling.