RF Microwave High‑Frequency Mixed‑Pressure PCB

RF Microwave Mixed‑Dielectric High‑Frequency PCB

This mixed‑dielectric high‑frequency PCB adopts hybrid lamination technology, combining Rogers‑series high‑frequency RF substrate and FR‑4 material. It is equipped with precision micro‑strip resonant transmission lines for millimeter‑wave signal processing, large solid‑copper ground planes, impedance‑controlled traces, as well as dense BGA pads and SMD component pads. Designed with irregular outline, alignment holes and tooling holes for convenient module assembly. The PCB delivers stable Dk/Df dielectric performance across microwave and millimeter‑wave frequency bands.

Typical Applications

Millimeter‑wave radar modules, RF transceiver units, microwave sensing, wireless communication systems