High Density Interconnect HDI PCBA for Miniaturized Electronics and Advanced Packaging
Price:
negotiate
MOQ:
Negotiable
Delivery Time:
15-30 Days
Brand:
Jiaqing Circuit
Product Description
This High Density Interconnect (HDI) PCBA is designed for the most demanding miniaturized electronics applications. Featuring fine lines and spaces (0.075mm/0.075mm), micro-vias (0.1mm diameter), and multiple build-up layers, HDI technology enables significantly higher component density than conventional PCBs. This assembly is ideal for advanced smartphones, AI computing modules, memory modules, and high-performance computing applications. The HDI process incorporates sequential lamination, laser drilling, and advanced plating techniques to achieve the interconnect density required by today's most advanced semiconductor packages.
Technical Specifications| Parameter | Specification |
|---|---|
| Technology | High Density Interconnect (HDI) |
| Minimum Line Width/Space | 0.075mm / 0.075mm |
| Minimum Via Diameter | 0.1mm (laser microvia) |
| Via Types | Blind, Buried, Stacked, Staggered |
| Layer Structure | Sequential build-up (1+N+1, 2+N+2, etc.) |
| Board Types | Rigid, Flex, Rigid-Flex |
| Component Types | Fine-pitch BGAs, CSPs, POPs |
| Application Areas | Smartphones, AI modules, Memory, HPC |
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Company
Shenzhen Jiaqing Circuit Co., Ltd.
Location
Building 1, Area A, Third Industrial Zone, Gonghe Community, Shajing Subdistrict, Bao'an District, Shenzhen
Contact Person
Zeng