Ultra Low Loss 10 Layer 400G Optical Module PCB RO5880 High Frequency High Speed Signal Integrity
The 400G optical module PCB is a high-frequency, high-speed printed circuit board specifically engineered for next-generation optical transceivers operating at 400Gbps data rates. Manufactured using advanced low-loss materials such as RO5880 high-frequency microwave laminate, MEGTRON 6, or hybrid stacks combining IT968TC and S1000-2M, this 10-layer board delivers exceptional signal integrity with minimized insertion loss and stable dielectric properties at high frequencies. Featuring HDI technology with laser-drilled microvias (0.10mm), fine line/space geometries down to 0.075mm/0.075mm, and tight impedance control (100±7%Ω, 50±10%), the 400G optical module PCB supports PAM4 modulation schemes up to 50Gbps per lane. With partial hard gold plating up to 50μ″ for enhanced wear resistance on contact fingers and ENIG or immersion silver surface finishes, this board is the ideal substrate for QSFP-DD, OSFP, and CFP8 form factor optical transceivers deployed in hyperscale data centers, AI clusters, and 5G communication infrastructure.
| Parameter | Specification |
|---|---|
| Application | 400G Optical Module / Optical Transceiver |
| Layer Count | 10 layers (up to 12 layers available) |
| Board Thickness | 1.0 ± 0.1 mm |
| Material Options | RO5880 high-frequency microwave laminate, MEGTRON 6, IT968TC + S1000-2M hybrid, Rogers 3000/4000 series |
| Dielectric Loss (Df @10GHz) | ≤0.002 – 0.0037 (material dependent) |
| Minimum Line Width/Space | 0.075mm / 0.075mm |
| Minimum Laser Microvia | 0.10mm |
| Minimum Mechanical Hole | 0.15mm |
| Impedance Control | 100 ± 7%Ω, 50 ± 10%Ω |
| Maximum Signal Rate | 50 Gbps per lane |
| HDI Technology | 3-step HDI with blind/buried vias, laser-drilled microvias |
| Surface Finish | Partial hard gold 50μ″ + ENIG / ENEPIG / Immersion Silver |
| Form Factor Support | QSFP-DD, OSFP, CFP8 |
| Dielectric Constant (Dk) | 3.0 – 3.48 (material dependent) |
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