Phase Changing Materials
High Dielectric Constant Insulating Pad Phase Changing Material 0.127mm for Electric Motor Control
TIC800D Series phase change material with 1.6 W/mK thermal conductivity and 5000VAC dielectric strength. Softens at 50°C to fill surface gaps, reducing thermal resistance. Ideal for IGBTs, MOSFETs, and motor control equipment. Custom die-cut available.
TS-Ziitek-Sharp Metal X01 Phase Change Thermal Interface Material - 18.9 W/mK Conductivity, 8.0 g/cm³ Density for Microprocessors
Advanced alloy phase change thermal interface material with 18.9 W/mK thermal conductivity and 8.0 g/cm³ density. Features non-toxic composition, excellent stability, and low thermal resistance for microprocessors, chipsets, and LED applications. Certified ISO9001:2015, ISO14001:2004, IATF16949:2016 with wide operating temperature range of -45°C to 250°C.
5.0W/mK Phase Change Material Thermal Pad for CPU GPU 0.014°C-in²/W Thermal Resistance
High reliability PCM with 5.0W/mK thermal conductivity and ultra-low 0.014°C-in²/W resistance. Softens at 50°C to fill gaps, reducing thermal resistance. No performance degradation after 1000 hours at 130°C. Ideal for CPUs, GPUs, and IGBTs. Custom thicknesses available.
TIC 808Y Thermal Phase Change Material 0.203mm 0.95 W/mK for Computer Servers
TIC 808Y series is a low melting point thermal interface material that softens at 50°C to fill microscopic gaps, reducing thermal resistance. Features 0.024°C-in²/W resistance, natural tack, and no preheating. Reliable after 1000 hours at 130°C. Ideal for CPUs, servers, and IGBTs.
TIC806A Phase Change Material 2.5 W/mK 0.152mm for High Frequency Microprocessors
TIC806A is a high-performance phase change thermal interface material with 2.5 W/mK conductivity and 0.152mm thickness. It softens above 50°C to fill gaps, reducing thermal resistance. Self-adhesive, low-pressure application. UL94 V-0 compliant. Ideal for power supplies, LEDs, and laptops.