TS-Ziitek-Sharp Metal X01 Phase Change Thermal Interface Material - 18.9 W/mK Conductivity, 8.0 g/cm³ Density for Microprocessors
TS-Ziitek-Sharp Metal X01 is an advanced alloy phase change thermal interface material specifically engineered to address heat dissipation and reliability challenges in high-performance electronic applications.
- High thermal conductivity of 18.9 W/mK at 25°C
- Non-toxic and environmentally safe composition
- Excellent long-term stability and reliability
- Low thermal resistance interface formation
- Stable physical and chemical properties
- Microprocessors and chipsets
- Graphic processing chips
- Set Top Box components
- LED thermal management
| Property | Value | Test Method |
|---|---|---|
| Color | Silvery white | Visual |
| Composition | Alloy | Manufacturer Specification |
| Density (g/cm³) | 8.0 @25°C 7.9 @80°C |
ASTM D792 |
| Thermal Conductivity (W/mK) | 18.9 @25°C 15.3 @80°C |
ISO22007-2.2 |
| Specific Heat Capacity (J/g°C) | 0.24 @25°C 0.26 @80°C |
ASTM E1269 |
| Resistivity (Ω-m) | <10⁻⁷ | ASTM D257 |
| Continuous Use Temperature (°C) | -45 to 250 | Ziitek Test Method |
| Phase Change Temperature Range (°C) | >60 | ASTM D3418 |
| Solidification Range (°C) | <57 | ASTM D3418 |
Storage: Recommended storage in warehouse environment at 18-30°C with maximum humidity not exceeding 70%.
Usage: Avoid contact with aluminum or metal surfaces. After application, use compatible thermal pad or foam to enclose and secure the area along the edges of the liquid metal to prevent leakage or spreading.
Ziitek is a specialized manufacturer of thermal management solutions including thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive interface pads, thermal grease, thermal conductive plastics, silicone rubber, silicone foams, and phase change materials.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Independent R&D Team: Company maintains dedicated research and development capabilities for continuous product innovation.
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