Thermal Gap Pad

High-performance thermal pad with 7.0 W/mK conductivity and 2.0mm thickness. Electrically isolating, UL 94 V0 rated, and durable. Custom sizes available for efficient GPU, CPU, and LED cooling.

High-performance thermal silicone pad with 7.0W/mK conductivity and 1.5mm thickness. Fiberglass reinforced for durability, UL94 V-0 rated, RoHS compliant. Reduces thermal resistance between heat sources and sinks for efficient cooling in electronics.

High-performance thermal silicone pad with 7.0 W/mK conductivity and 1.0mm thickness. Features low oil permeability, high softness, and UL94V0 rating. Ideal for cooling components in mobile phones, LEDs, and memory modules. Custom thicknesses available.

Ultra soft 0.5mm thermal pad with 7.0 W/mK conductivity, low hardness, and natural tack. Ideal for GPU, LED, and power modules. UL 94 V0 rated, electrically isolating, and available in custom thicknesses.

High-performance thermal pad with 7.0 W/mK conductivity and 5.0mm thickness. Soft, compressible silicone elastomer offers excellent vibration dampening and electrical isolation. Ideal for LED power supplies and high-voltage applications. UL 94 V0 rated, customizable thicknesses available.

Ultra-soft gap filler with 7.0W/mK thermal conductivity and 4.5mm thickness. Low assembly stress, conforms to rough surfaces. Electrically isolating, high durability, UL94 V0 rated. Ideal for automotive, IT, and consumer electronics.

TIF7160Z silicone pad offers 7.0W/mK thermal conductivity and high voltage insulation up to 5500VAC. Fiberglass reinforced for durability, UL recognized, RoHS compliant. Ideal for laptops, power supplies, and memory modules. Custom thickness available.

High-performance thermal pad with 7.0W/mK conductivity and 3.5mm thickness. Ceramic-filled silicone reduces thermal resistance between heat source and heatsink. Flame retardant, moldable, high tack surface. Ideal for CPU, GPU, automotive, and telecom applications.

High thermal conductivity of 7.0 W/mK and low thermal resistance. UL94 V-0 rated, operates from -40°C to 160°C. Naturally tacky, dual self-adhesive films. Custom thicknesses and hardness available for efficient heat dissipation.

TIF7100Z silicone thermal pad offers 7.0 W/mK conductivity, 55 Shore 00 hardness, and electrical isolation. Naturally tacky, available in varied thicknesses, and UL 94 V0 rated for reliable CPU and LED cooling.

High cost-effective thermal gap pad with 2.0mm thickness and 7.0 W/mK conductivity. Soft, compressible, electrically isolating, and vibration dampening. Ideal for automotive electronics, LED modules, and low-stress applications. Custom sizes available.

High-performance thermal graphite sheet with 7.0 W/mK conductivity and 1.5mm thickness. Soft, conformable, electrically isolating, and durable. Ideal for CPU, LED power supplies, and adapters. UL 94 V0 rated. Custom sizes available.

TIF740Z thermal pad offers 7.0 W/mK conductivity, 1.0mm thickness, and 55 Shore 00 hardness. Fiberglass reinforced for durability. UL recognized and RoHS compliant. Ideal for DVD-Rom, automotive electronics, and IT infrastructure cooling.

High-performance thermal pad with 7.0W/mK conductivity and 0.5mm thickness. Ultra-soft silicone base reduces contact resistance, ideal for LED modules and CPUs. UL94 V0 rated, customizable thickness, and excellent dielectric strength.

High-performance thermal gap pad with 6.0W/mK conductivity and 5.0mm thickness. Features low oil permeability, high softness, UL94V0 rating, and stable operation from -40°C to 160°C. Ideal for CPU, LED power supplies, and adapters. Custom thickness and hardness available.

High-performance silicone-based thermal pad with 6.0 W/mK conductivity and 30 Shore 00 hardness. Soft, compressible, and electrically isolating. UL94 V-0 rated. Ideal for automotive electronics, IT infrastructure, and portable devices. Custom thicknesses available.

High-performance thermal gap filler with 6.0 W/mK conductivity and 4.0mm thickness. Electrically isolating, low hardness (30 Shore 00) for minimal pressure. Ideal for notebooks, power supplies, and memory modules. UL94 V0 rated.

Ultra-soft thermal gap filler with 6.0W/mK conductivity and 30 Shore 00 hardness. Conforms to irregular surfaces for low-stress assembly. UL recognized, RoHS compliant, and fiberglass reinforced. Ideal for LED lighting, automotive ECUs, and telecom hardware. Custom sizes and shapes available.

High-performance thermal pad with 6.0W/mK conductivity and 3.0mm thickness. Fills gaps, insulates, and dampens. Ideal for display cards, LEDs, and memory modules. UL94 V0 rated, customizable.

TIF7100L-HM thermal pad offers 6.0 W/mK conductivity, 30 Shore 00 hardness, and UL94 V0 rating. Ultra-soft silicone base ensures low thermal resistance. Custom thicknesses available for LED, router, and power applications.