Thermal Gap Pad
Thermal Silicone Pad 2.0 W/mK 3.5mm Thickness for LED Power Supply Low Outgassing 0.35%
TIF1140-20-10UF thermal pad offers 2.0 W/mK conductivity, 0.35% outgassing, and UL94 V0 rating. Soft, compliant, and stable from -40 to 160°C. Ideal for LED power supplies and controllers. Custom thicknesses available.
3.0mm Thermal Gap Pad 2.0 W/mK Conductive Silicone for CD-ROM Cooling
TIF1120-20-10UF is a 3.0mm thick, soft and compressible thermal gap pad with 2.0 W/mK conductivity. Low hardness, naturally tacky, electrically isolating. Ideal for CD-ROM, automotive electronics, and IT infrastructure. UL94 V0 rated.
UL Recognized 2.5mm Thermal Gap Pad Silicone 2.0 W/mK for Heat Pipe Solutions
High-performance silicone gap pad with 2.0 W/mK thermal conductivity and 2.5mm thickness. UL recognized, electrically isolating, and durable from -40 to 160°C. Ideal for heat pipe thermal solutions, motherboards, and power supplies. Custom sizes available.
2.0mm Thick Conductive Silicone Pad 2.0 W/mK Thermal Insulation RoHS Compliant
TIF180-20-10UF thermal pad offers 2.0 W/mK conductivity, 2.0mm thickness, and 75 Shore 00 hardness. UL recognized and RoHS compliant, it ensures efficient heat transfer, insulation, and damping for LED lamps and electronics.
Specific Gravity 2.7 g/cc CPU Thermal Gap Pad 1.5mm 2.0 W/mK
High-performance thermal gap pad with 2.0 W/mK conductivity and 1.5mm thickness. Ceramic-filled silicone ensures durability and low thermal resistance. UL 94 V0 rated, ideal for CPUs, automotive ECUs, and telecom hardware. Custom sizes available.
Thermal Silicone Pad 2.0 W/mK 1.0mm Thickness Dielectric Constant 4.6 MHz for Routers LED
TIF140-20-10UF thermal silicone pad offers 2.0 W/mK conductivity, low thermal resistance, and high softness. With UL94V0 rating and stable -40°C to 160°C performance, it is ideal for routers and LED modules. Custom sizes and shapes available.
2.0 W/mK Thermal Gap Pad 0.5mm Soft Silicone for LED Controller Heat Dissipation
Soft and compressible 2.0 W/mK thermal gap pad, 0.5mm thick, with low hardness for minimal stress on components. Electrically isolating, UL 94 V0 rated, and ideal for LED controllers, power supplies, and adapters. Custom sizes and die-cut shapes available.
3.0mm Thickness Silicone Gap Filler Pad 3.2 W/mK Thermal Conductivity for Complex Parts
High-performance 3.0mm silicone gap filler pad with 3.2 W/mK thermal conductivity, low thermal resistance, and high softness for moldable complex parts. UL94V0 rated, operates from -40°C to 160°C. Ideal for automotive ECUs, telecom hardware, and semiconductors.
Thermal Gap Pad 3.2 W/mK 0.5mm Thickness Silicone UL94 V0 for Display Card
High-performance thermal silicone pad with 3.2 W/mK conductivity and >5500 VAC dielectric breakdown voltage. UL94 V0 rated, low oil permeability, and high softness. Ideal for CPUs, display cards, and automotive ECUs. Custom sizes and shapes available.
Silicone Thermal Pad 6.0 W/mK 2.0mm for LED Street Lamp Heat Dissipation
High-performance thermal silicone pad with 6.0 W/mK conductivity and 2.0mm thickness. Features low thermal resistance, high softness, and UL94V0 fire rating. Ideal for LED power supplies and controllers. Custom thickness options available.
Insulation Silicone Thermal Gap Filler Pad 3.2 W/mK 20 Shore 00 for LED Ceiling Lamp
Soft and compressible thermal pad with 3.2 W/mK conductivity, 20 Shore 00 hardness, and -40 to 160°C range. Electrically isolating, UL94 V0 rated, ideal for LED power supplies and ceiling lamps. Custom thickness available.
Thermal Conductive Silicone Sheet 4.5mm Thickness 1.2 W/mK for CPU LED Heat Sink
High-performance thermal conductive silicone sheet with 1.2 W/mK conductivity, 4.5mm thickness, and 2.0 g/cc density. Offers excellent vibration dampening, electrical isolation, and low-stress application. UL94 V0 rated, customizable thicknesses available.
1.0mm Thermal Gap Insulation Silicone Pad 3.2 W/mK for Notebook Heat Dissipation
High-performance thermal silicone pad with 3.2 W/mK conductivity and 1.0mm thickness. Features low thermal resistance, high tack surface, UL94 V-0 flame rating, and RoHS compliance. Ideal for notebooks, power supplies, and memory modules. Custom sizes available.
4.0 MHz Moldability Thermal Gap Pad 3.2 W/mK 2.5mm for SMD LED Module
TIF1100-32-05US silicone-based gap pad with 3.2 W/mK thermal conductivity, 20 Shore 00 hardness, and 4.0 MHz dielectric constant. Naturally tacky, electrically isolating, and UL 94 V0 rated. Ideal for SMD LED modules, LED power, and lighting applications.
3.2 W/mK Thermal Gap Pad 3.0g/cc Specific Gravity 1.5mm Thickness for Set Top Boxes
High-performance thermal gap pad with 3.2 W/mK conductivity and 3.0g/cc density. Electrically isolating, durable, and easy to handle. Ideal for set top boxes, automotive electronics, and IT infrastructure. Custom thickness options available.
Thermal Gap Pad TIF1160-18-01US 2.5 g/cc 4.0mm Thickness UL 94 V0 for Set Top Boxes
High-performance thermal gap pad with 1.8 W/mK conductivity, 4.0mm thickness, and UL 94 V0 fire rating. Fills gaps for efficient heat transfer, insulation, and damping. Ideal for set top boxes, power supplies, and LED controllers. RoHS compliant.
TIF740L-HM Thermal Pad 6.0 W/mK 1.0mm Thickness High Durability Silicone Gap Filler
High durability silicone thermal pad with 6.0 W/mK conductivity and 1.0mm thickness. Low hardness 30 Shore 00, electrically isolating, and conformable. Ideal for automotive electronics, IT infrastructure, and LED power. UL94 V0 rated. Custom thicknesses available.
Thermal Conductive Silicone Pad 8.0 W/mK Gap Filler for Heatsink Cooling 2.5mm
High-performance thermal pad with 8.0 W/mK conductivity and 2.5mm thickness. Electrically isolating, vibration dampening, and UL94 V-0 rated. Ideal for LED, power supply, and IT cooling. Custom sizes available.
Thermal Conductivity 8.0W/mK Heat Sink Thermal Pad 3.0mm for Electronic Devices CPU GPU
High performance thermal pad with 8.0W/mK conductivity and 3.0mm thickness. Electrically isolating, durable, and easy to apply. Ideal for CPUs, GPUs, LED power supplies, and IT infrastructure. UL94 V-0 certified, customizable thickness available.
Thermal Conductive Silicone Gap Pad Filler 8.0 W/mK 2.5mm for Laptop Cooling
High-performance thermal pad with 8.0 W/mK conductivity and 2.5mm thickness. Electrically isolating, vibration dampening, and UL94-V0 rated. Ideal for laptops, memory modules, and automotive electronics. Custom sizes available.