Thermal Conductive Adhesive

4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation TIG®680-40AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials.

Single-component thermally conductive silicone adhesive with 1.2W/mK thermal conductivity and UL94 V-0 rating. Features excellent electrical insulation, strong adhesion to metals, and operation temperature range of -60°C to 250°C. Ideal for LED cooling, power modules, and electronic component thermal management with 3-7 day cure time.

High Thermal Conductive 2.8W Two Component Potting Silicone Adhesive For Industrial Control TIG®680-28AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials. The low viscosity

TIS680-15AB two-component thermal potting adhesive offers 1.5W/mK conductivity with UL 94 V-0 fire resistance. Features low temperature curing, 30-minute pot life, and excellent insulation for LED lighting, transformers, and electronic device encapsulation. Available in 1KG, 5KG, and 10KG packaging options with free samples available.

Two-component silicone potting compound with 1.5 W/mK thermal conductivity and UL 94 V-0 fire resistance. Designed for LED power supplies, controllers, and electronic devices requiring efficient heat dissipation. Features low viscosity, excellent insulation, waterproof properties, and extended service temperature range from -40℃ to +160℃.