Thermal Conductive Gel

High-performance two-part thermally conductive putty with 3.5W/mK thermal conductivity for telecommunications and electronics. Features UL recognition, 30-minute cure time, natural tackiness, and optimized dispensing. Ideal for notebooks, set-top boxes, power monitoring, and heat sink applications with temperature range from -45°C to 200°C.

Advanced silicone-based thermal gel with 5.0 W/mK conductivity and very low compression force. Ideal for semiconductor automatic laboratory equipment, LED lighting, and high-power electronics. Features UL 94 V-0 flame rating, operates from -45°C to 200°C, and compatible with automated dispensing systems for consistent thermal performance.

High-performance silicone putty with 3W/mK thermal conductivity and 2,000,000 cps viscosity for BGA packages and electronic components. Features UL94 V-0 flame rating, -45°C to 200°C operating range, and compatibility with automated dispensing systems for efficient thermal management solutions.

High-performance two-component thermal gel with 3.0W/mK conductivity for automotive electronics. Features 900,000 cps viscosity, -45°C to 200°C operating range, UL94 V-0 flame rating, and flexible curing options. Ideal for heat dissipation in computers, telecommunications, and semiconductor applications.

Premium thermal silicone gel with 6.0 W/mK conductivity and UL 94 V-0 flame rating. Features soft ceramic-filled composition, low thermal impedance, and proven reliability for high-power electronics including LED lighting, microprocessors, and telecommunications equipment. Suitable for automated dispensing with custom packaging options available.

Premium thermal conductive gel with 4.5W/mK thermal conductivity and UL 94 V-0 flame rating. Features low thermal impedance, -45 to 200°C operating range, and compatibility with automated dispensing. Ideal for microprocessors, LED lighting, telecom equipment, and high-power electronic thermal management.

High-performance thermally conductive silicone putty with 4.0 W/mK thermal conductivity and 3.2 g/cc density. Features superior softness, low thermal impedance, and UL94 V-0 certification. Ideal for telecom equipment, LED lighting, and semiconductor applications with automated dispensing compatibility and proven reliability.

Soft silicone putty thermal gap filler with 1.5 W/mK thermal conductivity and 4000 Pa.s viscosity. Features UL 94V0 flame rating, -45°C to 200°C operating range, and compatibility with automated dispensing. Ideal for microprocessors, BGA packages, LED lighting, and automotive electronics with proven long-term reliability.

Premium yellow thermally conductive silicone gel with 2.0 W/mK thermal conductivity and V-0 flame rating. Ideal for LED lighting, heat-sink assemblies, and high-power electronic components. Features low thermal impedance, automated dispensing compatibility, and proven reliability for industrial applications.

High-performance silicone gel thermal putty with 3.5W/mK conductivity for electronics cooling applications. Features low thermal impedance, automated dispensing compatibility, and operating temperature range from -45°C to 200°C. Ideal for graphics cards, memory modules, LED lighting, and telecom equipment with UL, SGS, and ROHS certifications.

High-performance two-component silicone thermally conductive gel with 5.0W/mK thermal conductivity and UL94V-0 certification. Designed for efficient heat dissipation in electronics, featuring wide temperature range (-45°C to 200°C), easy dispensing, and excellent durability. Ideal for notebooks, power systems, and semiconductor cooling applications.

Excellent Thermal Conductivity 8.0W Thermal Conductive Gel For Telecom Industry TIF®080-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which efectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied

Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler for Telecon industry TIF®090-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIFo90-11 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications TIF®050-11-1 is a thermally conductive paste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good stability in

High Thermal Conductive Two Component Thermal Gel For Computer And Peripherals Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best

1.5 W/M-K China Thermal Conductive Gel For Electronic And Electrical Products TIFTM015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIFTM015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better. TIFTM015-07 operation mold is simliar as

High-performance silicone gel gap filler with 7.0W/mK thermal conductivity and UL 94 V-0 flame rating. Ideal for CPU cooling, LED lighting, and high-power electronics. Features low thermal impedance, automated dispensing compatibility, and proven reliability in thermal management applications.

High-performance thermal conductive putty with 5W/mK conductivity and -45°C to 200°C operating range. Features soft silicone composition, UL94 V-0 flame rating, and compatibility with automated dispensing systems. Ideal for LED lighting, BGA packages, and thermal management in automotive and telecom applications.

High-performance silicone thermal gel with 3.0W/mK conductivity and 3.25g/cc density. Features superior softness, low thermal impedance, and V-0 flame rating. Ideal for battery systems, LED lighting, microprocessors, and telecommunications equipment with operating range from -45°C to 200°C.

TIF015-07 silicone thermal gap filler putty provides 1.5W/mK thermal conductivity with excellent compressibility and low thermal impedance. This ceramic-filled material operates from -45°C to 200°C and is UL94V0 flame rated. Ideal for CPU/GPU cooling, LED lighting, telecommunications, and automotive applications with automated dispensing compatibility.