Most Popular Products
TIF 300 Series 3.0W/mK Thermal Conductivity Silicone Pads 0.5-5.0mm Thickness for Electronics Cooling
High-performance silicone thermal pads with 3.0W/mK conductivity and UL 94 V0 rating. Available in thicknesses from 0.5mm to 5.0mm, these naturally tacky pads provide excellent heat dissipation for LED systems, automotive electronics, and memory modules. Manufacturer-direct with custom die-cutting available.
TIF600P Series 6.0 W/m-K Thermally Conductive Silicone Pad | 0.25mm to 5.08mm Thickness Options
High-performance 6.0 W/m-K thermal conductivity silicone gap filler with exceptional conformability for low-stress applications. Features UL 94 V-0 rating, natural tackiness, and multiple thickness options from 0.25mm to 5.08mm. Ideal for LED lighting, automotive electronics, telecommunications, and memory module cooling applications.
Customizable 7.5W/mK Thermal Pads for Memory Modules - 0.020" to 0.200" Thickness Range
High-performance thermal interface pads with 7.5W/mK conductivity for memory modules and electronics cooling. Features natural tackiness, electrical isolation, UL94 V0 fire rating, and customizable thickness options from 0.020" to 0.200". Ideal for automotive, telecommunications, and portable electronics applications.
7W/mK Thermal Pads for CPU GPU Cooling - 0.020" to 0.200" Thickness Range - UL94V0 Rated
High-performance thermal pads with 7.0W/mK conductivity for efficient heat dissipation in laptops, CPUs, GPUs, and electronics. Features RoHS compliance, UL recognition, electrical isolation, and custom thickness options from 0.020" to 0.200". Ideal for demanding thermal management applications requiring reliability and safety.
TIF1100-05E Series 1.5W/mK UL Recognized Thermal Conductive Gap Pad - 35 Shore Hardness, -40°C to 160°C Range
Silicone-based thermal gap pad with 1.5W/mK conductivity and UL recognition. Features 35 Shore hardness, electrical isolation, and high tack surface for reduced contact resistance. Ideal for CPU, GPU, automotive electronics, and power supply applications with temperature range from -40°C to 160°C.
TIF TM900-15S Thermal Conductive Absorption Material - 1.5W/mK, 0.5-5.0mm Thickness for 5G & Industrial Electronics
Soft dark gray thermal conductive absorption material with 1.5W/mK thermal conductivity and electromagnetic noise absorption capabilities. Features 0.5-5.0mm thickness range, operating temperature -40°C to 160°C, and RoHS compliance. Ideal for 5G communications, automotive electronics, and industrial applications requiring heat dissipation and EMI reduction.
TIF600 Series 4.7W/m-K Thermal Interface Pad with High Tack Surface for Set Top Boxes and Electronics
High-performance silicone thermal pad with 4.7W/m-K conductivity and naturally tacky surface that reduces contact resistance. Features 45 Shore 00 hardness, UL 94 V0 fire rating, and temperature range from -45°C to 200°C. Ideal for power supplies, automotive electronics, and IT infrastructure with RoHS compliance.
TIF500S Series 3.2W/mK Thermal Conductive Gap Filler Pads 0.5-5.0mm Thickness Range
High-performance thermal interface pads with 3.2W/mK conductivity and 0.5-5.0mm thickness options. Features fiberglass reinforcement, UL 94-V0 rating, and RoHS compliance. Ideal for CPU cooling, power supplies, automotive electronics, and various heat dissipation applications.
Violet Thermal Pad 2.6 W/mK Thermal Conductivity with 0.25mm-5.0mm Thickness Range for Electronics Cooling
Customizable violet thermal pad with 2.6 W/mK thermal conductivity and 35 Shore 00 hardness. Available in thicknesses from 0.25mm to 5.0mm, UL 94 V0 flame rating, and dielectric breakdown voltage >55000 VAC. Ideal for CPU, memory modules, automotive electronics, and telecommunications hardware thermal management applications.
TIF400 2W/mK Thermal Pad for Telecommunications Hardware - 0.5mm to 5.0mm Thickness Range with UL94 V-0 Certification
High-performance silicone thermal pad with 2.0 W/mK conductivity for telecommunications and electronics cooling. Features natural tackiness, electrical isolation, vibration dampening, and operating range from -45°C to 200°C. Available in 20 standard thicknesses with pressure-sensitive adhesive options and UL94 V-0 certification.
TIF200-02E Thermal Conductive Silicone Pad 1.25 W/mK 0.5-5mm Thickness for CPU GPU Cooling
High-performance thermal conductive silicone pads with 1.25 W/mK thermal conductivity and thickness range of 0.5-5.0mm. Features natural tackiness, UL94 V0 flame rating, and -40 to 160°C operating temperature. Ideal for CPU, GPU, motherboard, and electronic cooling applications with excellent heat dissipation efficiency.