Silicone Thermal Pad

High-performance thermal conductive silicone pad with 2.0W/mK conductivity and UL94 V-0 fire rating. Available in 20 thickness options from 0.5mm to 5.0mm for optimal heat dissipation in LED systems, automotive electronics, and telecommunications equipment. Custom shapes and sizes available.

High-performance silicone thermal pad with 6.2 W/mK conductivity and natural tackiness for superior heat dissipation. Available in 0.25-5.08mm thickness options, UL 94 V0 flame rating, and temperature range from -40°C to 160°C. Ideal for IT infrastructure, LED systems, and electronic device cooling applications.

Professional-grade thermal interface material featuring 13.0W/mK thermal conductivity and natural tackiness for superior heat transfer. UL94 V-0 flame rated with operating range from -40 to 200°C. Ideal for automotive electronics, EV battery packs, telecommunications, and CPU cooling applications.

High-performance thermal interface material with 5.0 W/mK conductivity for automotive engine control units and electronics. Features UL recognition, RoHS compliance, 94 V0 fire rating, and electrical isolation. Available in 20 standard thicknesses from 0.25mm to 5.08mm with custom die-cut options available.

High-performance thermal interface material with 13.0W/mK conductivity for efficient heat dissipation in electronics. Features natural tackiness, UL94 V-0 flame rating, and custom thickness options from 0.75mm to 5.0mm. Ideal for automotive, telecom, and computing applications requiring reliable thermal management solutions.

High-performance 5.0mm thick silicone thermal pads with 3.0 W/mK conductivity for display cards and electronic cooling. Features 20 Shore 00 hardness, RoHS compliance, and operates from -40°C to 160°C. Ideal for automotive, telecommunications, and semiconductor applications with custom sizing options available.

High-performance thermal insulation pad with 1.5W/mK conductivity and 35 Shore 00 hardness. Features electrical isolation up to 5500VAC, UL94 V-0 fire rating, and temperature range from -40°C to 160°C. Ideal for LED systems, automotive electronics, CPUs, and telecommunications hardware requiring efficient heat dissipation.

Silicone-based thermal gap filler pad with 1.5W/m-K conductivity and natural tackiness requiring no adhesive. Available in thicknesses from 0.020" to 0.200" with UL 94 V0 rating. Ideal for notebook cooling, LED applications, and electronic thermal management with excellent conformability and electrical isolation.

High-performance silicone thermal pad with 1.5W/mK conductivity, UL certification, and 45 Shore 00 hardness. Designed for EV battery thermal management, LED systems, and electronic cooling applications. Available in 20 thickness options from 0.25mm to 5.08mm with pressure-sensitive adhesive options and fiberglass reinforcement.

High-performance silicone thermal conductive pad with 1.5W/mK thermal conductivity and 45 Shore 00 hardness. UL recognized with 94V0 fire rating, designed for LED TV, lighting systems, and electronic cooling applications. Available in thicknesses from 0.010" to 0.200" with pressure-sensitive adhesive options.

High-performance ceramic filled silicone thermal pad with 1.5W/mK thermal conductivity and 5.5 MHz dielectric constant. Features UL94 V-0 flame rating, fiberglass reinforcement, and operates from -40°C to 160°C. Ideal for LED systems, IT infrastructure, and electronic cooling applications with RoHS compliance and custom thickness options.

Advanced silicone thermal pad with 1.5W/mK conductivity and 35 Shore 00 hardness. Features electrical isolation, UL 94 V0 rating, and excellent conformability for CPU, LED, and telecommunications applications. Available in thicknesses from 0.020" to 0.200" with pressure-sensitive adhesive options.

Various Thicknesses Thermal Conductive Gap Pad For Automotive IT Infrastructur The TIF® 160-05S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the

High-performance thermal interface pad with 1.5W/mK conductivity and UL94 V-0 rating. Designed for automotive engine control units, LED systems, and telecommunications hardware. Features fiberglass reinforcement, natural tackiness, and electrical isolation. Available in thicknesses from 0.25mm to 5.08mm with custom die-cut options available.

1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application Product Overview The TIF®100-10-01U Series thermal gap filler pads utilize a specialized manufacturing process with silicone as the base material, incorporating thermal conductive powder and flame retardant additives to create an effective thermal interface material. This formulation significantly reduces thermal resistance between heat sources and heat sinks. Product Image Key Features

Blue Heat Sink Thermal Pad 0.5-5.0mmT For 5G Artificial Intelligence Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support

Factory Supply Ultra Soft Thermal Gap Pad UL Recognized For Power Supply Product Overview The TIF® 140-02F Series uses a special process with silicone as the base material, adding thermal conductive powder and flame retardant to create an effective thermal interface material that reduces thermal resistance between heat sources and heat sinks. Key Features Good thermal conductivity: 1.5W/mK Naturally tacky - no additional adhesive coating required Soft and compressible for low

Premium Performance Thermal Pad Ultra Soft 1.5W/MK Thermal Conductive Silicone Pad 1mmT For Audio Components The TIF® 140-07S Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. Company Profile Ziitek

RoHS Compliant Thermal Gap Pad 1.5 W/MK Easy Release Construction For Rainproof LED Power Company Profile Ziitek is a high-tech enterprise dedicated to the R&D, manufacturing, and sales of thermal interface materials (TIMs). With extensive experience in this field, we provide the latest, most effective thermal management solutions. Our facility features advanced production equipment, comprehensive testing capabilities, and fully automatic coating production lines for high