Heat Sink Thermal Pad

Professional thermal interface pad with 3 W/mK conductivity for CPU and display card cooling applications. Features UL94 V-0 flame rating, electrical isolation, and natural tackiness without additional adhesive. Available in multiple thicknesses from 0.25mm to 5.08mm with custom die-cut options for industrial electronics.

High-performance thermal interface material with 6W/mK conductivity for automotive and electronic applications. Features natural tackiness, electrical isolation, RoHS compliance, and temperature range from -40°C to 200°C. Available in multiple thicknesses with pressure-sensitive adhesive options and fiberglass reinforcement.

High-performance grey silicone thermal pad with 5 W/mK conductivity for 5G and artificial intelligence applications. Features natural tackiness, 20 Shore 00 hardness, and -40 to 160℃ operating range. Available in thicknesses from 0.5mm to 5.0mm with custom die-cut options. Ideal for automotive ECUs, telecom hardware, and semiconductor test equipment.

High-performance thermal interface material with 4.0W/mK conductivity and ultra soft 20 Shore 00 hardness. This ceramic-filled silicone pad provides excellent heat transfer, insulation, and damping properties for LED lighting, automotive electronics, telecommunications, and portable devices. Available in thicknesses from 0.5mm to 5.0mm with custom die-cutting options.

High-performance thermal pad with 3.0 W/mK conductivity and 1.75mm thickness for efficient heat dissipation in mass storage devices and electronic assemblies. Features electrical isolation up to 5500 VAC, excellent vibration dampening, and multiple international certifications including ISO9001 and UL.

High-performance thermal silicone pad with 3.0W/mK conductivity and UL94V0 flame rating. Available in thicknesses from 0.5mm to 5.0mm, operating from -40℃ to 160℃. Ideal for CPU, GPU, automotive electronics, and power supply thermal management applications.

Professional-grade silicone thermal pad with 1.5 W/mK thermal conductivity and 35 Shore 00 hardness. Available in thicknesses from 0.25mm to 5.0mm for efficient heat transfer in LED systems, telecommunications, automotive electronics, and portable devices. UL94 V-0, SGS, and ROHS compliant.

Customizable ceramic-filled silicone thermal insulation pads with 8.0W/mK thermal conductivity and 60±10 hardness. Features natural tackiness, 94-V0 flame rating, and operates from -40 to 160℃. Ideal for CPU cooling, LED lighting, routers, and electronic equipment requiring efficient heat transfer and insulation.

Product Overview TIF® 160-20-10UF Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability. Key Features Good thermal

Product Overview The 5.0mmT Heat Sink Thermal Pad delivers reliable thermal conductivity for mainboards, VGA cards, notebooks, and LED lighting applications. Designed to fill interface gaps and transfer heat efficiently, it also provides structural support and durability for stacked components. Company Profile Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With extensive experience in this field, we support

Product Description EV Thermal Interface Material Silicone 2.0W/MK Thermal Conductive Pads are engineered for audio and video components, delivering reliable heat dissipation and structural support. The TIF® 1180-20-10UF series is a structurally supportive thermal pad designed to provide good heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting

Product OverviewThe TIF® 1160-20-10UF Series is a structurally supportive thermal pad designed to deliver effective heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and provides mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.Key FeaturesGood

Product Overview The TIF® 1140-20-10UF Series is a structurally supportive thermal pad designed to deliver reliable heat dissipation while ensuring mechanical support and durability. It effectively fills interface gaps, transfers heat, and provides mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications requiring a balance between heat dissipation, insulation, and mechanical stability. Key Features Good

3.0mmT Thickness 2.0W/MK High Performance CPU Thermal Pad — Soft Silicone Thermal Pad for CPU Cooling Company Profile Ziitek Electronic Material and Technology Ltd was founded in 2006 and is headquartered in Dongguan, Guangdong. It is a high-tech enterprise specializing in heat conduction, heating, sealing, and EMI products. To respond quickly to global customer demand, the company has established production bases in Kunshan (Jiangsu), Taiwan Province, and Vietnam, and

Product Overview The TIF® 1100-20-10UF Series is a structurally supportive thermal pad designed to deliver reliable heat dissipation while ensuring mechanical support and long-term durability. It reliably fills interface gaps, transfers heat, and provides mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications requiring a balance between heat dissipation, electrical insulation, and mechanical stability.

Product Overview The Heat Sink Thermal Pad with 2.0 W/mK is engineered for superior thermal management in power box applications. It delivers reliable heat dissipation while providing structural support and durability for demanding electronic assemblies. Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials for the competitive market. Our vast experience

Product Overview The Heat Sink Thermal Pad is engineered for efficient heat transfer across a wide range of electronic and industrial applications, including motherboards, VGA cards, notebooks, LED lighting, and server power systems. It reliably fills interface gaps, transfers heat, and provides mechanical support for stacked components while resisting compressive deformation. Company Profile Ziitek, founded in 2006, has been deeply involved in the field of thermal management

Product Overview The Heat Sink Silicone Thermal Pad (0.5mm Thickness) is a high-performance thermal interface material engineered for efficient heat dissipation in LED TV systems and other demanding electronic applications. This structurally supportive pad reliably fills interface gaps, transfers heat, and provides mechanical support for stacked components while resisting compressive deformation. Company Profile Ziitek, founded in 2006, is a high-tech enterprise specializing

Wholesale Customized High Temperature Thermal Conductive Silicone Insulation Pad For Display card GPU Laptop​ Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic

Soft Ideal Thermal Pads 2.5mm Thickness Thermal Conductivity 7.5W/M.K With Self-Adhesive For Repairing And Cooling Electronics Company Profile Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry,