CPU Thermal Pad

High-performance thermal silicone pad with 1.5 W/mK conductivity and UL94 V-0 rating. Available in thicknesses from 0.25mm to 5.0mm for CPU, GPU, and motherboard cooling applications. Features natural tackiness, excellent compressibility, and operates from -40°C to 160°C. Custom adhesive and reinforcement options available.

High-performance thermal conductive gap filler with 1.5W/mK thermal conductivity and 45 Shore 00 hardness. UL recognized, RoHS compliant, and electrically isolating. Ideal for GPU, CPU, LED applications, and telecommunications hardware with temperature range -40°C to 160°C.

High-performance thermal interface material with 2.6W/mK conductivity, available in thicknesses from 0.010" to 0.200". Features high tack surface, moldability for complex parts, and UL 94 V0 fire rating. Ideal for CPU, memory modules, LED systems, and motherboard applications with ISO9001 and IATF16949 certifications.

High-performance thermal interface material with 1.2W/mK thermal conductivity and 0.012" thickness. Features UL recognition, RoHS compliance, and polyimide film reinforcement. Ideal for CPU cooling, memory modules, automotive electronics, and telecommunications hardware. Available with ISO9001, IATF16949, and multiple quality certifications.

High-performance 1.5W/mK thermal conductivity pads designed for CPU and RDRAM memory module cooling. Features multiple thickness options, UL 94 V0 fire rating, and excellent electrical insulation. Certified with ISO9001, IATF16949, and IECQ QC 080000 standards for reliable thermal management solutions.

High-performance thermal interface material with 1.5W/mK conductivity and electrical isolation properties. UL recognized with 94V0 fire rating, available in thicknesses from 0.010" to 0.200". Ideal for CPU cooling, memory modules, automotive electronics, and portable devices with continuous operation from -40°C to 160°C.

TIF100N-20-16S series thermal pads provide 2.0W/mK conductivity with 1.6g/cc specific gravity for lightweight thermal management. RoHS compliant and UL recognized, these pads operate from -40°C to 160°C, ideal for industrial routers, power supplies, and automotive electronics.

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Particularly Soft 1.5W/MK Thermal Gap Filler Pad For AI Processors AI Servers Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface

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