Thermal Conductive Gel
High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications
High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications TIF®050-11-1 is a thermally conductive paste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good stability in
Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler for Telecon industry
Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler for Telecon industry TIF®090-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIFo90-11 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent
1.5 W/M-K China Thermal Conductive Gel For Electronic And Electrical Products
1.5 W/M-K China Thermal Conductive Gel For Electronic And Electrical Products TIFTM015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIFTM015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better. TIFTM015-07 operation mold is simliar as
TIF070-11 Thermal Conductive Silica Gel Pad 7.0W/mK for CPU Heat Dissipation and LED Cooling
High-performance silicone gel gap filler with 7.0W/mK thermal conductivity and UL 94 V-0 flame rating. Ideal for CPU cooling, LED lighting, and high-power electronics. Features low thermal impedance, automated dispensing compatibility, and proven reliability in thermal management applications.
TIF050-11 5W/mK Violet Soft Silicone Thermal Conductive Putty for LED Lights and Electronics
High-performance thermal conductive putty with 5W/mK conductivity and -45°C to 200°C operating range. Features soft silicone composition, UL94 V-0 flame rating, and compatibility with automated dispensing systems. Ideal for LED lighting, BGA packages, and thermal management in automotive and telecom applications.
TIF®030-05 Thermal Conductive Gel 3.0W/mK One-Component Putty for Battery Power and LED Applications
High-performance silicone thermal gel with 3.0W/mK conductivity and 3.25g/cc density. Features superior softness, low thermal impedance, and V-0 flame rating. Ideal for battery systems, LED lighting, microprocessors, and telecommunications equipment with operating range from -45°C to 200°C.
TIF015-07 Thermal Gap Filler Putty - 1.5W/mK Thermal Conductivity, -45°C to 200°C Operating Range
TIF015-07 silicone thermal gap filler putty provides 1.5W/mK thermal conductivity with excellent compressibility and low thermal impedance. This ceramic-filled material operates from -45°C to 200°C and is UL94V0 flame rated. Ideal for CPU/GPU cooling, LED lighting, telecommunications, and automotive applications with automated dispensing compatibility.
TIF050AB-11S Two-Component Thermally Conductive Gel - 5.0W/mK Thermal Conductivity, UL94V-0 Certified Gap Filler
High-performance two-component silicone thermally conductive gel with 5.0W/mK thermal conductivity and UL94V-0 certification. Designed for efficient heat dissipation in electronics, featuring wide temperature range (-45°C to 200°C), easy dispensing, and excellent durability. Ideal for notebooks, power systems, and semiconductor cooling applications.