Thermal Conductive Gel

High-performance thermal conductive putty with 4.0W/mK thermal conductivity and UL recognition. Features two-component formulation, -45°C to 200°C operating range, and optimized dispensing characteristics. Ideal for notebooks, LED systems, power supplies, and heat-sensitive electronic components requiring reliable thermal management.

High-performance thermal putty with 2.0W/mK conductivity and UL recognition. Two-component formulation provides excellent heat dissipation for CPUs, GPUs, and electronic components. Features 45 Shore 00 hardness, -45°C to 200°C operating range, and 94V0 flame rating. Ideal for notebooks, set-top boxes, and power systems.

High-performance thermal conductive gel with 3.5W/mK thermal conductivity and UL recognition. This two-component liquid gap filler cures to a dry, touchable elastomer for efficient heat dissipation in notebooks, set-top boxes, and power systems. Offers excellent durability, natural tackiness, and optimized dispensing characteristics for electronic applications.

Excellent Thermal Conductivity 8.0W Thermal Conductive Gel For Telecom Industry TIF®080-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which efectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied

High Conductivity Thermal Gel 5.0W/MK Insulation Thermal Conductive Gel Suitable For PCB Applications TIF®050-11-1 is a thermally conductive paste with excellent interface thermal resistance characteristics and outstanding plasticity, capable of fully meeting the strict thermal management performance requirements of various designs; this material has extremely low hardness, possesses free-forming ability, and is easy to construct and assemble, demonstrating good stability in

Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler for Telecon industry TIF®090-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIFo90-11 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent

1.5 W/M-K China Thermal Conductive Gel For Electronic And Electrical Products TIFTM015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIFTM015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better. TIFTM015-07 operation mold is simliar as

High-performance thermal conductive putty with 5W/mK conductivity and -45°C to 200°C operating range. Features soft silicone composition, UL94 V-0 flame rating, and compatibility with automated dispensing systems. Ideal for LED lighting, BGA packages, and thermal management in automotive and telecom applications.

TIF015-07 silicone thermal gap filler putty provides 1.5W/mK thermal conductivity with excellent compressibility and low thermal impedance. This ceramic-filled material operates from -45°C to 200°C and is UL94V0 flame rated. Ideal for CPU/GPU cooling, LED lighting, telecommunications, and automotive applications with automated dispensing compatibility.

High-performance two-component silicone thermally conductive gel with 5.0W/mK thermal conductivity and UL94V-0 certification. Designed for efficient heat dissipation in electronics, featuring wide temperature range (-45°C to 200°C), easy dispensing, and excellent durability. Ideal for notebooks, power systems, and semiconductor cooling applications.