8 Layer PCB

8 Layer PCB Used In GPS Module Blue Solder Mask ENIG Main Features: 1 8 Layer Printed Circuit Board with very high relability. 2 PCB drawing size is 118.8mm*115mm/12pcs 3 Copper thickness is 35 um on each layer 4 FR4 substrate material ,TG150 degree. 5 Surface treatment is immersion gold. Our Capabilities: NO Item Capability 1 Layer Count 1-24 Layers 2 Board Thickness 0.1mm-6.0mm 3 Finished Board Max Size 700mm*800mm 4 Finished Board Thickness Tolerance +/-10% +/-0.1(

ENIG Gold Finger FR4 TG150 8 Layer PCB Matte Black Solder Mask Color ENIG 8 Layer Printed Circuit Board Gold Finger PCB PCB Specifications: Part NO: S08E5551A0 Layers: 8Layer Surface Finished: Immersion gold + Gold Finger Material: FR4 Thickness: 0.9mm PCB Size: 104mm*80mm Minimum Wire Width: 3.5mils Smallest finish hole size: 0.2mm Finished copper: 1OZ Solder Mask colour: Matte Black Silkscreen colour: White Standard: IPC-A-600G Class II Certificates: UL/94V-0/ISO Our

8 Layer Via In Pad Treatment PCB Black Solder Mask Main Features: 1 8 Layer Printed Circuit Board with very high relability. 2 PCB drawing size is 142mm*96mm/1pcs 3 Copper thickness is 35 um on each layer 4 FR4 substrate material ,halogen free material. 5 Surface treatment is immersion gold. 6 Gold thickness is 1U'. 7 Finished board thickness is 1.6mm. 8 Gerber file or PCB file should be offered by customer before production. Our Equipment List: NO Equipment Name Equipment

8 Layer PCB Super Heavy Copper High Voltage Resistance 4 OZ Copper Power Supply Products Main Features: 1 8 Layer Printed Circuit Board with very high relability. 2 Used in power supply products and UPS , need to bear high voltage. 3 Heavy copper thickness 4 OZ on each layer. 4 FR4 substrate material , high tg degree. 5 Surface treatment is immersion gold. 6 Gold thickness is 2U'. 7 Finished board thickness is 2.0mm. 8 Gerber file or PCB file should be offered by customer

8 Layer PCB Halogen Free Printed Circuit Board 1.0 MM Thickness Main Features: 1 8 Layer Printed Circuit Board with very high relability. 2 PCB drawing size is 118.8mm*111mm/12pcs 3 Copper thickness is 35 um on each layer 4 FR4 substrate material ,halogen free material. 5 Surface treatment is immersion gold. 6 Gold thickness is 1U'. 7 Finished board thickness is 1.0mm. 8 Gerber file or PCB file should be offered by customer before production. Our Equipment List: NO Equipment

8 Layer PCB Used In Video Meeting Systems OSP Treatment Main Features: 1 8 Layer Printed Circuit Board with very high relability. 2 PCB drawing size is 192.5mm*120.28mm/2pcs 3 Copper thickness is 35 um on each layer 4 FR4 substrate material , TG170 degree. 5 Surface treatment is OSP. 6 BGA pad size 8.8mil. 7 Finished board thickness is 1.2mm. 8 Gerber file or PCB file should be offered by customer before production. 9 Differential impedance control 50ohm S1000-2 Material Data

8 Layer PCB FR4 TG180 Material Used In Industrial Control Main Features: 1 8 Layer Printed Circuit Board with very high relability. 2 PCB drawing size is 175.36mm*118.74mm/2pcs 3 Copper thickness is 35 um on each layer 4 FR4 substrate material , TG180 degree. 5 Surface treatment is ENIG 3U'. 6 BGA pad size 12mil. 7 Finished board thickness is 1.6mm. 8 Gerber file or PCB file should be offered by customer before production. S1000-2 Material Data Sheet: S1000-2 Items Method

8 Layer PCB Used In GPS Module Blue Solder Mask ENIG Main Features: 1 8 Layer Printed Circuit Board with very high relability. 2 PCB drawing size is 118.8mm*115mm/12pcs 3 Copper thickness is 35 um on each layer 4 FR4 substrate material ,TG150 degree. 5 Surface treatment is immersion gold. 6 Gold thickness is 1U'. 7 Finished board thickness is 1.6mm. 8 Gerber file or PCB file should be offered by customer before production. Our Capabilities: NO Item Capability 1 Layer Count 1

8 Layer PCB Used In GPS Module Blue Solder Mask ENIG Main Features: 1 8 Layer Printed Circuit Board with very high relability. 2 PCB drawing size is 118.8mm*115mm/12pcs 3 Copper thickness is 35 um on each layer 4 FR4 substrate material ,TG150 degree. FAQ: Q1:What is PCB Grid Testing or Bed of Nails Testing? A1: Grid testing or Bed of Nails testing is a process used to check the performance of components mounted on a PCB board. This test uses a frame/fixture that contains

8 Layer PCB Used In GPS Module Blue Solder Mask ENIG Our Capabilities: NO Item Capability 1 Layer Count 1-24 Layers 2 Board Thickness 0.1mm-6.0mm 3 Finished Board Max Size 700mm*800mm 4 Finished Board Thickness Tolerance +/-10% +/-0.1(