Printed Circuit Boards

Printed Circuit Boards Double Sided PCB 1.6 MM Finished Thickness PCB Requirements: 1 The following marks should be printed from the component side: UL Logo, Material Code, Flammability Rating, Manufacturer name or symbol as indicated in UL yellow card. This should be printed with ink. 2 PCB thickness and drill hole size specified are finished sizes. 3 The tool mark for pcb if used should be a blind hole i.e no copper or mask should be present around the tool mark from either

Printed Circuit Boards 16 Layer Super Thick FR4 Substrate 5.0MM Board Thickness Main Features: 1 16 Layer PCB made from FR4 Material, high TG FR4, TG180, which has high stability. 2 The PCB is customized product. It was produced according to customoer's gerber design and requirement. 3 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated 4 The surface treatment is immersion gold and gold thickness is 2u'. 5 Need to use high TG prepreg during lamination, TG 180 Prepreg. 6 Used

10 Layer Printed Circuit Boards Custom Printed Circuit Board Main Features: 1 10 Layer PCB made from FR4 Material, high TG FR4, TG180, which has high stability. 2 The PCB is customized product. It was produced according to customoer's gerber design and requirement. 3 The solder mask is green solder mask and copper thickness is 1oz each layer. 4 The surface treatment is immersion gold and gold thickness is 2u'. 5 Need to use high TG prepreg during lamination, TG 180 Prepreg. 6

Printed Circuit Boards 4 Layer PCB In Red Solder Mask And OSP Treatment Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as

thermal conductive copper substrate 1 layer PCB PCB Specifications: Part NO: 04B2302176 Layers: 1Layer Surface Finished: HASL Material: copper sbstrate Thickness: 1.6mm PCB Size: 172.72 * 157.48 mm Finished copper: 1OZ Solder Mask colour: white Silkscreen colour: black Special Features: thermal conductive Standard: IPC-A-600G Class II Certificates: UL/94V-0/ISO Our Product Categories: Our Product Categories Material Kinds Layer Counts Treatments FR4 Single Layer HASL Lead

ENIG Copper Substrate PCB High Power LED Thermoelectric Separation Hign Power LED Thermoelectric Separation Copper Substrate 1 Layer ENIG Printed Circuit Board PCB PCB Specifications: Part NO: LEDPCB00001 Layer Count: 1 Layer Printed Circuit Board Finished Board Thickness: 1.8mm Copper Thickness: 1 Material: Copper Substrate Application Area: Hign Power LED Special Feature: Thermoelectric Separation Surface Treatment: ENIG Our Product Categories: 1 FR4 substrate PCB : 2 Layer

4 Layer ENIG Printed Circuit Boards With Different Silkscreen Color 4 layer ENIG Printed Circuit Board with different solder mask color and different silkscreen color on both sides PCB Specifications: Part NO: PCB5266A0 Layer Count: 4 Layer Printed Circuit Board Finished Board Thickness: 1.6mm Copper Thickness: 2/1/1/2oz Material: FR4,tg170 Board size: 258.7*139.05 Special Feature: two different solder mask and silkscreen color on both sides Surface Treatment: ENIG Our

Single Layer PCB CEM-1 With Carbon Ink OSP Surface Treatment Specifications: 1. Single Layer 2. CEM-1 Material 3. OSP Surface Treatment 4. Carbon Ink 5. Board thickness: 1.2mm 6. Used in telephone Packing Specifications: 1 One vacuum pcb package should not be over 25 panels based on panel size. 2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage. 3 The pcb package must be suitable to ensure effective vacuum sealing. 4 Every package

Copper Substrate PCB Cu Based Single Layer Used In Stage Lamp Specifications: 1 Layer Count: Single Layer 2 Material: Copper substrate 3 PCB board thickness: 2.0MM 4 Conductivity: 2 W/MK 5 Surface Treatment: OSP 6 Application: Stage Lamp 7 Solder Mask: White 8 Silkscreen: Black FQA: Q1: What are Copper Based PCBs? A1: Copper-based PCBs use copper as a primary base material in place of commonly used FR4. The copper base material is then covered with an insulating layer

2 W/MK Conductivity Aluminum Substrate Single Layer PCB Used In Led Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: Aluminum 3.2 Min Tg: 150DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 1U 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6 Editing of

2 OZ Copper 2 Layer PCB Photovoltaic Inverter Used Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 150DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6 Editing of

2 W/MK Conductivity Aluminum Substrate Single Layer PCB Used In Led Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: Aluminum 3.2 Min Tg: 150DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 1U 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6 Editing of

3 W/MK Conductivity Copper Substrate Single Layer PCB Used In Led Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: Aluminum 3.2 Min Tg: 150DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 1U 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6 Editing of

Printed Circuit Boards 6 Layer PCB With Impedance Control 100 Ohm Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6

Printed Circuit Boards 6 Layer PCB 94V-0 FR4 Substrate Material PCB Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.

Printed Circuit Boards 8 Layer PCB 1.6 MM Finished Board Thickness Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 150DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.

Printed Circuit Boards 12 Layer PCB Immersion Gold PCB Requirements: 1 The following marks should be printed from the component side: UL Logo, Material Code, Flammability Rating, Manufacturer name or symbol as indicated in UL yellow card. This should be printed with ink. 2 PCB thickness and drill hole size specified are finished sizes. 3 The tool mark for pcb if used should be a blind hole i.e no copper or mask should be present around the tool mark from either side of the

Printed Circuit Boards 14 Layer PCB FR4 Substrate Material Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6

Printed Circuit Boards 8 Layer PCB With 100 Ohm PCB Specifications: 1 Board layers 8 layer see layer stackup 2 Board material laminate should be 0.031inch +/-10% 3 Finished glass epoxy laminate, type nema grade or equivalent 4 Outer layer to be 0.5OZ Copper clad 5 Construction should meet class 94v-0 6 Layer construction alignment max: +-0.05mm Our Product Ranges: Our Product Categories Material Kinds Layer Counts Treatments FR4 Single Layer HASL Lead Free CEM-1 2 Layer

Printed Circuit Boards 4 Sides Copper 1 OZ White Legend Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6 Editing