Multilayer Circuit Board

Multilayer Circuit Board 12 Layer PCB FR4 Material Hight TG Immserion Gold Main Features: Part NO: Multi-Layer PCB0005 Layer Count: 12 Layer PCB Finished Board Thickness: 1.6MM Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H1 Min Lind Space&Width: 3.3/3.3mil Application Area: Consumer Porducts Outline Size: 210MM*78MM/3PCS Outline tolerance: +/-0.13mm Copper wall thickness for plated through holes: 25um Packing Specifications: 1 One vacuum pcb package should not be over 25 panels

Multilayer Circuit Board 16 Layer PCB 2.0 MM Thickness PCB Specifications: 1 Part NO: Multi-Layer PCB0025 2 Layer Count: 16 Layer PCB 3 Finished Board Thickness: 2.0MM 4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1 5 Min Lind Space&Width: 3/3mil 6 Application Area: Industrial Control Material Data Sheet: S1130 Items Method Condition Unit Typical Value Tg IPC-TM-650 2.4.25 DSC ℃ 135 Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 310 CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm

Multi Layer Circuit Board 4 Layer Printed Circuit Board Blue Solder Mask PCB Specifications: 1 Part NO: Multi-Layer PCB0028 2 Layer Count: 4 Layer PCB 3 Finished Board Thickness: 0.8MM 4 Copper Thickness: 1/1/1/1 OZ 5 Min Lind Space&Width: 3.5/3.5 mil 6 Application Area: Consumer Electronics Material Data Sheet: S1000-2 Items Method Condition Unit Typical Value Tg IPC-TM-650 2.4.25 DSC ℃ 180 IPC-TM-650 2.4.24.4 DMA ℃ 185 Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 345 CTE (Z-axis)

14 Layer PCB FR4 Material High Green Solder Mask 3 Mil Line Width Main Features: 1 A 14 layer printed circuit board with finish board thickness at 2.0mm. 2 Solder mask in green color and white silkscreen. 3 Exposed copper pad surface to do immersion gold treatment. 4 All inner layer copper thickness is half OZ and outer layer copper thickness is 1OZ. 5 Copper wall thickness for plated through holes: 25um 6 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated PCB report have to

Multilayer Circuit Board 20 Layer PCB FR4 Material 2.5/2.5Mil Lind Space&Width PCB Specifications: 1 Part NO: Multi-Layer PCB0024 2 Layer Count: 20 Layer PCB 3 Finished Board Thickness: 2.4MM 4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1 5 Min Lind Space&Width: 2.5/2.5mil 6 Application Area: Consumer Porducts IR No : QCR Reference : Date: PCB DESCRIPTION C-dot Part Number of PCB Name of the PCB No of Layers : 20 Density Classification : E PCB Size: Length Breadth

Video Conference Device Used Pcb 1.2mm Matte Black Solder Mask PCB Specifications: 1 Part NO: PCB00356 2 Layer Count: 4 Layer PCB 3 Finished Board Thickness: 1.2MM 4 Copper Thickness: 1/1/1/1 OZ 5 Min Lind Space&Width: 3.0/3.0 mil 6 Application Area: Video Meeting Device Material Data Sheet: S1000-2 Items Method Condition Unit Typical Value Tg IPC-TM-650 2.4.25 DSC ℃ 180 IPC-TM-650 2.4.24.4 DMA ℃ 185 Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 345 CTE (Z-axis) IPC-TM-650 2.4.24

Hard Disk Printed Circuit Board 4 Layer 1.2mm Thickness PCB Specifications: 1 Part NO: SSDPCB0003 2 Layer Count: 4 Layer PCB 3 Finished Board Thickness: 1.2MM 4 Copper Thickness: 1/H/H/1 OZ 5 Min Lind Space&Width: 3.0/3.0 mil 6 Application Area: Hard Disk Material Data Sheet: S1000-2 Items Method Condition Unit Typical Value Tg IPC-TM-650 2.4.25 DSC ℃ 180 IPC-TM-650 2.4.24.4 DMA ℃ 185 Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 345 CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45

6 Layer OSP Green Solder Mask Circuit Board 1 OZ CU Main Features: Part NO: OSPPCB0001 Layer Count: 6 Layer PCB Finished Board Thickness: 1.6MM Copper Thickness: 1/H/H/H/H/1 Min Lind Space&Width: 4/4mil Application Area: Invertor Solder Mask: Green Solder Mask Acceptance Standards: IPC 6012 CLASS2 Copper wall thickness for plated through holes: 25um Our production applications: 1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power

8 Layer Black Solder Mask Printed Circuit Board 1 OZ CU Main Features: 1 A 14 layer printed circuit board with finish board thickness at 1.6mm. 2 Solder mask in green color and white silkscreen. 3 Exposed copper pad surface to do immersion gold treatment. 4 All inner layer copper thickness is half OZ and outer layer copper thickness is 1OZ. 5 Copper wall thickness for plated through holes: 25um 6 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated PCB report have to include

Red Solder Mask FR4 Substrate Material 1 OZ Copper Thickness OSP Treatment PCB Specifications: 1 Part NO: Multi-Layer PCB000351 2 Layer Count: 8 Layer PCB 3 Finished Board Thickness: 1.6MM 4 Copper Thickness: 1/1/1/1/1/1 OZ 5 Min Lind Space&Width: 3.5/3.5 mil 6 Application Area: Amplifier Material Data Sheet: S1000-2 Items Method Condition Unit Typical Value Tg IPC-TM-650 2.4.25 DSC ℃ 180 IPC-TM-650 2.4.24.4 DMA ℃ 185 Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 345 CTE (Z-axis) IPC

Multilayer Circuit Board 8 Layer PCB Immersion Gold Main Features: Part NO: Multi-Layer PCB0005 Layer Count: 8 Layer PCB Finished Board Thickness: 1.2MM Copper Thickness: 1/H/H/H/H/H/H/1 Min Lind Space&Width: 4/4mil Application Area: Industrial Control Outline Size: 201.5*120/2PCS Outline tolerance: +/-0.1mm Copper wall thickness for plated through holes: 25um Packing Specifications: 1 One vacuum pcb package should not be over 25 panels based on panel size. 2 The vacuum pcb

Multi Layer Circuit Board 6 Layer Printed Circuit Board Red Solder Mask PCB Specifications: 1 Part NO: Multi-Layer PCB0027 2 Layer Count: 6 Layer PCB 3 Finished Board Thickness: 1.6MM 4 Copper Thickness: 1/1/1/1 OZ 5 Min Lind Space&Width: 4.5/4.5 mil 6 Application Area: Medical Equitepments Material Data Sheet: S1130 Items Method Condition Unit Typical Value Tg IPC-TM-650 2.4.25 DSC ℃ 135 Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 310 CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃

Multi Layer Circuit Board 8 Layer Printed Circuit Board Red Solder Mask PCB Specifications: 1 Part NO: Multi-Layer PCB0026 2 Layer Count: 8 Layer PCB 3 Finished Board Thickness: 2.0MM 4 Copper Thickness: 1/1/1/1/1/1 OZ 5 Min Lind Space&Width: 4/4 mil 6 Application Area: Industrial Control Material Data Sheet: S1130 Items Method Condition Unit Typical Value Tg IPC-TM-650 2.4.25 DSC ℃ 135 Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 310 CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 65

3 Layer PCB Isola Material TG250 Hard Gold Plating 200U' Product Info: PCB Part Name: PCB0026 Layer Count: 3 Layer Material: ISOLA TG250 Board Thickness: 3.0MM Surface Treatment: Hard Gold Plating 200U' Application: Robots Multi-Layer PCB Flow Chart:

Multilayer Circuit Board 6 Layer PCB Immersion Silver Main Features: Part NO: Multi-Layer PCB0006 Layer Count: 6 Layer PCB Finished Board Thickness: 0.8MM Copper Thickness: 25 UM Min Lind Space&Width: 2.8mil Application Area: Computer Accessoryies Outline Size: 120MM*65MM/6PCS Outline tolerance: +/-0.1mm Copper wall thickness for plated through holes: 15um Our production applications: 1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable

Multilayer Circuit Board 12 Layer PCB FR4 Material Hight TG Immserion Gold Main Features: Part NO: Multi-Layer PCB0001 Layer Count: 12 Layer HDI PCB Finished Board Thickness: 1.6MM Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H1 Min Lind Space&Width: 3/3mil Application Area: Consumer Porducts Outline Size: 230MM*95MM/1PCS Outline tolerance: +/-0.13mm Copper wall thickness for plated through holes: 25um Packing Specifications: 1 One vacuum pcb package should not be over 25 panels