4 Layer PCB

4 Layer PCB 1.2 MM Thickness Used In TWS Earphone Main Features: 1 4 Layer Printed Circuit Board PCB . 2 Immersion Gold treatment, gold thickness 1u'. 3 FR4 substrate material, tg130 degree. 4 Min line space and width 6/6 mil. 5 Copper thickness is 1 oz on each layer, 35 um on each layer. 6 Green solder mask and white silkscreen. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated Our Product Categories: Our Product Categories Material Kinds Layer Counts Treatments FR4

PCB Edge Plating FR4 ENIG 1u' 4 Layer PCB PCB Specifications: Part NO: 04B2302176 Layers: 4Layer Surface Finished: Immersion gold 1u' Material: FR4 Thickness: 1.0mm PCB Size: 103 * 125.9 mm Finished copper: 1OZ Solder Mask colour: Black Silkscreen colour: White Special Features: PCB edge copper plating/matalization on three sides of the circuit board Standard: IPC-A-600G Class II Certificates: UL/94V-0/ISO Our Product Categories: Our Product Categories Material Kinds Layer

Immersion Gold 4 Layer PCB 1.6mm Board Thickness Green Solder Mask 4 Layer Immersion Gold PCB 1.6MM Board Thickness Green Mask Main Features: 1 4 Layer Printed Circuit Board PCB . 2 Immersion Gold treatment, gold thickness 1u'. 3 FR4 substrate material, tg150 degree. 4 Min line space and width 4/4 mil. 5 Copper thickness is 1 oz on each layer, 35 um on each layer. 6 Green solder mask and white silkscreen. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated 8 Application Area

4 Layer 2 OZ CU PCB With TG170 FR4 Material Printed Circuit Board ​ Main Features: 1 4 Layer Printed Circuit Board PCB . 2 Immersion Gold treatment, gold thickness 2u'. 3 FR4 substrate material, tg170 degree. 4 Min line space and width 5/5mil. 5 Copper thickness is 2 OZ on out layer, 1 OZ on inner layer 6 Greensolder mask and white silkscreen. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated 8 Application product: Industrial Control S1150G Material Data Sheet: S1150G

4 Layer PCB 1.6 MM Board Thickness Black Solder Mask Ink Main Features: 1 4 Layer Printed Circuit Board PCB . 2 Immersion Gold treatment, gold thickness 1u'. 3 FR4 substrate material, tg150 degree. 4 Min line space and width 3.5/3.5mil. 5 Copper thickness is 1 oz on each layer, 35 um on each layer. 6 Black solder mask and white silkscreen. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated 8 Application product: Cameras S1150G Material Data Sheet: S1150G Items Method

4 Layer PCB Immersion Gold Treatment 1.0 MM Board Thickness Green Mask Main Features: 1 4 Layer Printed Circuit Board PCB . 2 Immersion Gold treatment, gold thickness 1u'. 3 FR4 substrate material, tg170 degree. 4 Min line space and width 4/4 mil. 5 Copper thickness is 1 oz on each layer, 35 um on each layer. 6 Green solder mask and white silkscreen. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated 8 Application Area: Earphones Our Product Categories: Our Product

4 Layer PCB 1.6 MM Thickness 1 OZ Copper Red Solder Mask Main Features: 1 4 Layer Printed Circuit Board PCB . 2 Immersion Gold treatment, gold thickness 1u'. 3 FR4 substrate material, tg150 degree. 4 Min line space and width 6/6mil. 5 Copper thickness is 1 oz on each layer, 35 um on each layer. 6 Black solder mask and white silkscreen. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated Our Product Categories: Our Product Categories Material Kinds Layer Counts Treatments FR4

4 Layer PCB 1.2 MM Thickness 1 OZ Copper Green Solder Mask Main Features: 1 4 Layer Printed Circuit Board PCB . 2 Immersion Gold treatment, gold thickness 1u'. 3 FR4 substrate material, tg130 degree. 4 Min line space and width 6/6 mil. 5 Copper thickness is 1 oz on each layer, 35 um on each layer. 6 Green solder mask and white silkscreen. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated Our Product Categories: Our Product Categories Material Kinds Layer Counts Treatments

4 Layer PCB 1.6 MM Thickness 1 OZ Copper Black Solder Mask Main Features: 1 4 Layer Printed Circuit Board PCB .2 Immersion Gold treatment, gold thickness 1u'.3 FR4 substrate material, tg150 degree.4 Min line space and width 3.5/3.5mil.5 Copper thickness is 1 oz on each layer, 35 um on each layer.6 Black solder mask and white silkscreen.7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated Our Product Categories: Our Product CategoriesMaterial KindsLayer CountsTreatmentsFR4Sing

Ultra Thin 4 Layer Printed Circuit Board Immersion Gold Treatment Main Features: 1 4 Layer Printed Circuit Board PCB . 2 Immersion Gold treatment, gold thickness 2u'. 3 FR4 substrate material, tg170 degree. 4 Min line space and width 3/3mil. 5 Copper thickness is H/H/H/H OZ 6 Green solder mask and white silkscreen. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated Our Product Categories: 1 FR4 substrate PCB : 2 Layer Printed Circuit Board, 4 Layer PCB, 6 Layer PCB, 8 Layer

4 Layer Printed Circuit Board Immersion Gold Treatment Green Solder Mask Main Features: 1 4 Layer Printed Circuit Board PCB . 2 Immersion Gold treatment, gold thickness 2u'. 3 FR4 substrate material, tg150 degree. 4 Min line space and width 4/4mil. 5 Copper thickness is 1 oz on each layer, 35 um on each layer. 6 Green solder mask and white silkscreen. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated Our Product Categories: 1 FR4 substrate PCB : 2 Layer Printed Circuit

4 Layer Printed Circuit Board Blue Solder Mask OSP Treatment PCB Main Features: 1 4 Layer customized printed circuit board. 2 OSP treatment Organic Solderability Preservatives. 3 1OZ copper on each layer. 4 Blue solder mask. 5 4 Layer with very precised line width&space. 6 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated 7 Our product is customized product. S1170G Material Data Sheet: S1170G Items Method Condition Unit Typical Value Tg IPC-TM-650 2.4.24.4 DMA ℃ 180 Td IPC