HDI PCB

4 Layer HDI PCB 0.8 MM Thickness Epoxy Filled In Vias Main Features: 1 4 Layer HDI PCB with blind and buried holes. 2 Green solder mask and immersion gold treatment. 3 Min hole size is 0.1mm and min BGA size is 7.1 mil. 4 Finished board thickness is 0.8 mm. 5 The production cost will be higher than normal multilayer pcb and lead time will also be longer. 6 Drilling: L1-L2 0.15MM, L1-L3 0.15MM, L1-L4 0.15MM 7 Drilling 0.2MM holes on BGA PAD, Need to do epoxy filled in vias 8

HDI circuit board FR4 TG170 substrate ENIG 2u' 10 Layer PCB PCB Specifications: Part NO: S10E5012A0 Layers: 10Layer Surface Finished: Immersion gold 2u' Material: FR4 Thickness: 1.8mm PCB Size: 154mm*143mm Finished copper: 1OZ Solder Mask colour: Green Silkscreen colour: White Blind hole size: 0.127mm (1-2/9-10) Buried hole size:0.127mm (2-3/2-9/8-9) Though hole size: 0.3mm (1-10) No. of PP: 8pcs PP Certificates: UL/94V-0/ISO Our Product Categories: Our Product Categories

Selective Immersion Gold 6 Layer HDI PCB With Blind Holes And Buried Holes PCB Specifications: 1 Part NO: HDIPCB0011 2 Layer Count: 6 Layer HDI PCB 3 Finished Board Thickness: 1.2MM 4 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM 5 Min Lind Space&Width: 2.9/2.8mil 6 Copper Thickness: 1/H/H/H/H1 7 Application Area: Smart Watch 8 PCB Size: 136MM*101.5MM/9PCS Our production applications: 1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices

Selective Immersion Gold 6 Layer HDI PCB With Blind Holes And Buried Holes PCB Specifications: 1 Part NO: HDIPCB0011 2 Layer Count: 6 Layer HDI PCB 3 Finished Board Thickness: 1.0MM 4 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM 5 Min Lind Space&Width: 2.8/2.7mil 6 Copper Thickness: 1/H/H/H/H1 7 Application Area: Smart Watch 8 PCB Size: 113.1MM*101.1MM/6PCS Our production applications: 1 Consumer electronic products: SSD, TWS earphones, headsets,computer

HDI PCB 10 Layer 1.6 MM Thickness FR4 TG170 Material PCB Specifications: 1 Part NO: HDIPCB0009 2 Layer Count: 10 Layer HDI PCB 3 Finished Board Thickness: 1.6MM 4 Drilling: L1-L2 0.1MM, L3-L8 0.2MM, L9-L10 0.1MM, L1-L10 0.2MM 5 Min Lind Space&Width: 4/6mil 6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1 7 Application Area: Automobiles Our production applications: 1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules,

HDI PCB 6 Layer Blue Solder Mask Immersion Gold Treatment 1.0 MM Thickness PCB Specifications: 1 Part NO: HDIPCB0008 2 Layer Count: 6 Layer HDI PCB 3 Finished Board Thickness: 1.0MM 4 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM 5 Min Lind Space&Width: 2.8/3.6mil 6 Copper Thickness: 1/1/1/1/1/1 7 Application Area: Consumder Electronics 8 PCB Size: 140.86MM*108.71MM/2PCS Our production applications: 1 Consumer electronic products: SSD, TWS earphones, headsets

HDI PCB 10 Layer 1.0MM Thickness Immersion Gold 2U' FR4 Substrate PCB Specifications: 1 Part NO: HDIPCB0005 2 Layer Count: 10 Layer HDI PCB 3 Finished Board Thickness: 1.0MM 4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM, L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM 5 Min Lind Space&Width: 3/3mil 6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1 7 Application Area: Optical Module Our production applications: 1 Consumer electronic products: SSD

6 Layer HDI PCB 1.6 MM Thickness Epoxy Filled In Vias Main Features: 1 4 Layer HDI PCB with blind and buried holes. 2 Green solder mask and immersion gold treatment. 3 Min hole size is 0.1mm and min BGA size is 10 mil. 4 Finished board thickness is 0.8 mm. 5 The production cost will be higher than normal multilayer pcb and lead time will also be longer. 6 Drilling: L1-L2 0.15MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM 7 Drilling 0.2MM holes on BGA PAD, Need to do epoxy filled

10 Layer HDI PCB 1.0MM Thickness 8Mil BGA PAD Product Info: Part NO: HDIPCB0025 Layer Count: 10 Layer HDI PCB Finished Board Thickness: 1.0MM Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM, L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM Min Lind Space&Width: 2.5/2.5mil Copper Thickness: 1/H/H/H/H/H/H/H/H/1 Application Area: Consumer Porducts Our Plant Show:

HDI PCB High Density Interconnected 8 Layer Black Solder Mask Main Features: 1 8 Layer HDI PCB, high density printed circuit board. 2 Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM, L7-L8 0.1MM 3 Buried holes: L4-L7 0.2MM. 4 Via holes: L1-L8 0.2MM. 5 PCB thickness is 1.0mm. 6 Min BGA ball size is 10mil. 7 Min line space and width is 2.5/2.5mil. 8 Material is FR4 Substrate, tg180 degree 9 S1000-2 material used. S1000-2 Material data

HDI PCB High Density Interconnected Printed Circuit Board With Blind And Buried Holes Main Features: 1 10 Layer HDI PCB, high density printed circuit board. 2 Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L9-L10 0.1MM, L8-L9 0.1MM 3 Buried holes: L4-L7 0.2MM. 4 Via holes: L1-L10 0.2MM. 5 PCB thickness is 1.0mm. 6 Min BGA ball size is 8mil. 7 Min line space and width is 3/3mil. 8 Material is FR4 Substrate, tg180 degree 9 S1000-2 material used. S1000-2 Material data sheet: S1000-2

8Layer HDI PCB 1.6 MM Thickness Epoxy Filled In Vias Main Features: 1 8 Layer HDI PCB with blind and buried holes.2 Green solder mask and immersion gold treatment.3 Min hole size is 0.1mm and min BGA size is 11.8mil.4 Finished board thickness is 1.6mm.5 The production cost will be higher than normal multilayer pcb and lead time will also be longer.6 Drilling: L1-L3 0.15MM, L3-L6 0.15MM, L6-L8 0.15MM, L1-L8 0.2MM7 Drilling 0.2MM holes on BGA PAD, Need to do epoxy filled in

8 Layer HDI PCB FR4 Material Blind And Buried Holes High TG170 Main Features: 1 8 Layer HDI PCB with blind and buried holes. 2 Green solder mask and immersion gold treatment. 3 Min hole size is 0.1mm and min BGA size is 9mil. 4 Finished board thickness is 0.8mm. 5 The production cost will be higher than normal multilayer pcb and lead time will also be longer. 6 Need 3 round laminations and 4 round drillings. 7 2+N+2 hole structure: L1-L2 L2-L3 L1-L3 L7-L8 L6-L7 L6-L8 0.1MM,

HDI PCB 10 Layer 1.2MM Thickness Immersion Gold 2U' FR4 Substrate PCB Specifications: 1 Part NO: HDIPCB0026 2 Layer Count: 10 Layer HDI PCB 3 Finished Board Thickness: 1.2MM 4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM, L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM 5 Min Lind Space&Width: 2.5/2.5mil 6 Copper Thickness: H/H/H/H/H/H/H/H/H/H 7 Application Area: Consumer Porducts Our production applications: 1 Consumer electronic

HDI PCB 4 Layer Blind And Buried Holes 1.6 MM Thickness TG 150 Material PCB Specifications: 1 Part NO: HDIPCB0013 2 Layer Count: 4 Layer HDI PCB 3 Finished Board Thickness: 1.6MM 4 Drilling: L1-L2 0.15MM, L1-L4 0.2MM 5 Min Lind Space&Width: 6/6mil 6 Copper Thickness: 1/1/1/1 OZ 7 Application Area: Consumer Products 8 File Format: Gerber File 9 PCB Size: 110mm*100mm/6pcs 10 Other Requirements: 0.2MM Holes on BGA PAD, Need to do epoxy filled in vias Our production applications:

HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate Green Solder Mask PCB Specifications: 1 Part NO: HDIPCB0014 2 Layer Count: 10 Layer HDI PCB 3 Finished Board Thickness: 1.6MM 4 2+N+2 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L2-L9 0.2MM,L8-L9 0.1MM, L9-L10 0.1MM, L1-L100.2MM 5 Min Lind Space&Width:5/5mil 6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1 7 Application Area: Automobile 8 PCB Size: 154mm*143mm/1pcs 9 PCB Drawing File Size: Gerber File X-OUT per panel: 1 X-OUT panel must be

HDI PCB 4 Layer Blue Solder Mask Immersion Gold Treatment 1.6 MM Thickness PCB Specifications: 1 Part NO: HDIPCB0006 2 Layer Count: 4 Layer HDI PCB 3 Finished Board Thickness: 1.6MM 4 Hole Structure: L1-L2 0.1MM, L2-L3 0.2MM, L3-L4 0.1MM 5 Min Lind Space&Width: 4/4mil 6 Copper Thickness: 1/H/H/1 7 Application Area: WIFI Module Our production applications: 1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules,

HDI PCB 10 Layer 1.6 MM Thickness FR4 TG 170 Material PCB Specifications: 1 Part NO: HDIPCB0014 2 Layer Count: 10 Layer HDI PCB 3 Finished Board Thickness: 1.6MM 4 3+N+3 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L1-L3 0.1MM, L3-L8 0.1MM, L8-L9 0.1MM, L9-L10 0.1MM, L8-L10 0.1MM, L1-L100.2MM 5 Min Lind Space&Width: 2.0/2.4mil 6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1 7 Application Area: Industrial Control 8 PCB Size: 100mm*95mm/1pcs Our production applications: 1 Consumer electronic

HDI PCB 6 Layer Black Solder Mask FR4 Material 0.6 MM Thickness PCB Specifications: 1 Part NO: HDIPCB0016 2 Layer Count: 6 Layer HDI PCB 3 Finished Board Thickness: 0.6MM 4 2+N+2 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM,L1-L6 0.2MM 5 Min Lind Space&Width:3/3mil 6 Copper Thickness: 1/H/H/H/H/1 7 Application Area: Mobile Phone Charge 8 PCB Size: 113.42mm*92.88mm/6pcs 9 PCB Drawing File Size: Gerber File X-OUT per panel: 1 X-OUT panel must be packed separately and marked