Printed Circuit Boards

Printed Circuit Boards 4 Layer PCB With Impedance Control 50ohm Main Features: 1 This pcb is made from FR4 TG150 material which has high reliability. 2 4 Layer with very precised line width&space 3 The surface treatment is immersion gold 4 Used in industrial control area, such as motors, sensor, machines 5 Need customer to send us the gerber file or PCB file 6 Our product is customized product. 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated Our Product Ranges: Our

Printed Circuit Boards 4 Layer PCB Green Solder Mask PCB Requirements: 1 The following marks should be printed from the component side: UL Logo, Material Code, Flammability Rating, Manufacturer name or symbol as indicated in UL yellow card. This should be printed with ink. 2 PCB thickness and drill hole size specified are finished sizes. 3 The tool mark for pcb if used should be a blind hole i.e no copper or mask should be present around the tool mark from either side of the

Printed Circuit Boards 10 Layer PCB High TG Degree FR4 Material Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6

Printed Circuit Boards 6 Layer PCB Middle TG Degree FR4 Material Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 150DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6

Printed Circuit Boards 18 Layer PCB 3 Mil Trace And Space Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3 Dielectric: FR4 Per IPC or equivalent 3 Min Tg: 150DEG 3 Copper: As per stack up 3 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6 Editing of

Printed Circuit Boards 10 Layer PCB With 1 OZ Copper On Each Layer PCB Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as

Printed Circuit Boards 2 Layer PCB With HAL Lead Free PCB Specifications: 1 2 Layer FR4 substrate material printed circuit board. 2 Double layer copper, copper thickness is 35um/35um. 3 Finished pcb thickness is 1.2mm. 4 2 layer pcb with 4/4mil min line space and width. 5 Green solder mask and white silkscreen. 6 Need customer to send us the gerber file or PCB file 7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated S1130 Data Sheet: S1130 Items Method Condition Unit Typical

Printed Circuit Boards 4 Layer PCB 0.8 MM 1 OZ CU Specifications: 1. Board Laminate: Board layers 4 layer see layer stackup Board material laminate should be 0.031inch +/-10% Finished glass epoxy laminate, type nema grade or equivalent Outer layer to be 0.5OZ Copper clad Construction should meet class 94v-0 Layer construction alignment max: +-0.05mm 2. Holes: Copper plate through all holes with a minimum wall thickness of 0.0254mm Register tolerance : +-0.015mm All holes must

Aluminum Substrate PCB Single Layer Used In Led Light Specifications: 1. Board Laminate: Aluminum Substrate 2. Conductivity is 2 W/MK 3. PCB finished thickness is 2.0MM 4. White solder mask 5. 1OZ Copper on top side Delivery Acceptance Requirements: Test All boards are tested in accordance with IPC-9252A Working Gerber Paste layers must be provided on working gerbers. If Paste layer is missing, alert us in EQ. Fab File Check original customer Fab file if provided. If there is

Printed Circuit Boards 4 Layer PCB In Blue Solder Mask Specifications: 1. Board Laminate: Board layers 4 layer see layer stackup Board material laminate should be 0.031inch +/-10% Finished glass epoxy laminate, type nema grade or equivalent Outer layer to be 0.5OZ Copper clad Construction should meet class 94v-0 Layer construction alignment max: +-0.05mm 2. Holes: Copper plate through all holes with a minimum wall thickness of 0.0254mm Register tolerance : +-0.015mm All holes