Hot Press Cushion Pad
FPC Cushion Mat 25MPa Tensile Strength ≤260°C Heat Resistance for PCB Manufacturing
Professional FPC cushion mat with 25MPa tensile strength and ≤260°C heat resistance. Features
Estar ESCP-FPC-G3 PCB Press Cushion Pad 1.5-2.0mm High Molecular Weight Polymer for FPCB Hot Press
Professional PCB press cushion pad with 1.5-2.0mm thickness range and high electrical insulation properties. Made from durable high molecular weight polymer, this rectangular pad offers excellent buffering, thermal conductivity, and chemical resistance for FPCB lamination processes. Features low water absorption (
Estar ESCP-FPC-G3 PCB Press Cushion Pad 1.5-2mm Thickness with 100-200 Cycle Life and 260°C Temperature Resistance
Professional PCB press cushion pad with 100-200 cycle service life and 260°C temperature resistance. Features ≥25 MPa tensile strength,
FPC Flexible PCB Cushion Pad 25 MPa Tensile Strength 1.5-2mm Thickness for Electronic Manufacturing
High-performance FPC cushion pad with ≥25 MPa tensile strength and 1.5-2mm thickness for flexible PCB pressing operations. Features smooth surface finish, temperature resistance up to 200℃, and service life of 100-200 cycles. Ideal for lightweight and bendable electronic products manufacturing with reliable cushioning protection.
Hot Press Lightweight FPCB Cushion Pad for FPC Lamination - 20% Material Cost Savings, Automated PCB Buffer Mat
Specialized FPC cushion pad designed for flexible printed circuit board lamination processes. Features superior buffering performance, higher stability, and replaces multiple Kraft paper layers with one pad for at least 20% material cost reduction. Ideal for automated PCB manufacturing operations requiring consistent yield and efficiency improvements.
4mm-6.5mm High Temperature PCB Press Cushion Pad - 280℃ Resistant, 300-500 Cycle Life
ESCP-PCB-G2 rigid PCB cushion pad replaces kraft paper with superior dimensional stability and 280℃ temperature resistance. Features 300-500 cycle service life, ≥25 MPa tensile strength, and reduces material costs by 20%. Ideal for automated PCB laminating operations with excellent buffering and thermal conductivity performance.