Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules
China company supplied thermal gap filler 4w/MK Specific Gravity 3.1 g/cc for RDRAM memory modules
The TIF5200-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
TIF500-40-11US Datasheet-REV02.pdf
Features:
> Good thermal conductive: 4.0 W/mK
>Thickness:5.0mmT
>hardnesses :20 (Shore 00)
>UL recognized
>Fiberglass reinforced for puncture, shear and tear resistance
>Easy release construction
>Electrically isolating
>High durability
Applications:
>RDRAM memory modules
>Micro heat pipe thermal solutions
>Automotive engine control units
>CD-Rom, DVD-Rom cooling
>LED Power Supply
>LED Controller
>LED Ceilinglamp
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Typical Properties of TIF5200-40-11US Series
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Color
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gray |
Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone rubber
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*** | 10mils / 0.254 mm |
0.55 |
| 20mils / 0.508 mm |
0.82 |
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Specific Gravity
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3.1 g/cc |
ASTM D297 |
30mils / 0.762 mm |
1.01 |
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40mils / 1.016 mm |
1.11 |
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| Thickness |
5.0mmT |
*** |
50mils / 1.270 mm |
1.27 |
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60mils / 1.524 mm |
1.45 |
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Hardness
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20 (Shore 00) | ASTM 2240 |
70mils / 1.778 mm |
1.61 |
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80mils / 2.032 mm |
1.77 |
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| Tensile Strength |
40 psi |
ASTM D412 |
90mils / 2.286 mm |
1.91 |
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100mils / 2.540 mm |
2.05 |
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Continuos Use Temp
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-40 to 160℃ |
*** |
110mils / 2.794 mm |
2.16 |
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120mils / 3.048 mm |
2.29 |
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Dielectric Breakdown Voltage
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>5500 VAC | ASTM D149 |
130mils / 3.302mm |
2.44 |
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140mils / 3.556 mm |
2.56 |
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Dielectric Constant
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4.0 MHz | ASTM D150 |
150mils / 3.810 mm |
2.67 |
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160mils / 4.064 mm |
2.77 |
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Volume Resistivity
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6.0X1013 Ohm-meter |
ASTM D257 |
170mils / 4.318 mm |
2.89 |
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180mils / 4.572 mm |
2.98 |
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Fire rating
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94 V0 |
equivalent UL |
190mils / 4.826 mm |
3.05 |
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200mils / 5.080 mm |
3.14 |
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Thermal conductivity
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4.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
FAQ:
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.