Thermal Conductive Adhesive

High-performance two-component silicone adhesive with 1.0W/mK thermal conductivity for bonding metal and PCB components. Features UL 94 V-0 fire resistance, 45-minute working time, and excellent thermal shock resistance. Ideal for LED lighting, transformers, and electronic device encapsulation with multiple packaging options available.

Two-part silicone potting adhesive with 1.2W/mK thermal conductivity and 65 Shore A hardness. Features room temperature curing, UL94 V-0 fire resistance, and excellent thermal management for LED lights, capacitors, and electronic components. Provides superior insulation, flexibility, and extended operational life for industrial applications.

One-component room temperature cure silicone adhesive with 1.0W/mK thermal conductivity and UL94 V-0 rating. Features excellent electrical insulation, strong adhesion to metals, and non-corrosive dealcoholized formula. Ideal for LED systems, power modules, and electronic encapsulation with 3-7 day cure time and 6-month shelf life.

TIS™580-12 Series thermal conductive silicone adhesive offers 1.2W/mK thermal conductivity with 20K cps viscosity for void-free application. This dealcoholized, room-temperature curing adhesive provides excellent electrical insulation, strong adhesion to metals, and UL94 V-0 flame retardancy. Ideal for replacing thermal pastes and pads in electronics cooling applications.

High-performance one-component epoxy adhesive with 2.5 W/m·K thermal conductivity and 140,000 cPs viscosity. Features excellent bond strength, thermal shock resistance, and compatibility with metals and ceramics. Ideal for high-speed production lines with stencil printing capability and fast heat curing from 100°C to 170°C.

High-performance two-component silicone thermal conductive glue with 2.8W/mK thermal conductivity and UL 94 V-0 fire resistance. Designed for LED lighting applications, this 85 Shore D hardness material provides excellent insulation, waterproof protection, and operates from -40℃ to +200℃. Ideal for potting capacitors, transformers, and electrical devices with extended service life.

Single-component thermally conductive silicone adhesive with 1.2W/mK thermal conductivity and excellent electrical insulation. Features low shrinkage, strong adhesion to metals, and operates from -60°C to 250°C. UL94 V-0 flame retardant certified for LED heatsinks, power modules, and electronic assemblies.

Single-component thermally conductive silicone adhesive with 1.2W/mK thermal conductivity and UL94V-0 rating. Features excellent electrical insulation, adhesion to metals, and operation from -60°C to 250°C. Ideal for LED cooling, electronics heat management, and industrial applications requiring reliable thermal interface solutions.

High-performance two-component silicone potting compound with 3.5W/mK thermal conductivity and UL 94 V-0 fire resistance. Designed for LED heat spreaders, power drivers, and electronic components requiring efficient heat dissipation and excellent insulation properties. Operating temperature range from -40°C to 160°C with low viscosity for easy application.

Two-component silicone encapsulant with 2.8W/m-K thermal conductivity and UL 94 V-0 fire resistance rating. Designed for LED lighting heat spreaders, power drivers, and electronic component potting. Features low viscosity, 30-minute pot life, and operating range from -40℃ to 160℃. Enhances thermal management and extends component lifespan in industrial applications.

TIS®580-25 is a one-component, room-temperature curing silicone adhesive with 2.5W/mK thermal conductivity. Features excellent adhesion, moisture resistance, and UL94 V-0 flame rating. Ideal for bonding, insulation, and sealing in household appliances and electronics. Operates from -50°C to 250°C.

TIG 680-28AB series is a two-component silicone adhesive with 2.8W/mK thermal conductivity, UL94 V-0 flame rating, and low viscosity for superior heat dissipation. Ideal for potting capacitors, transformers, and LED drivers. Offers excellent flexibility, long working time, and custom options.

TIG 680-40AB Series is a two-component high thermal conductivity silicone sealant with 4.0 W/mK thermal conductivity and V-0 flame rating. It offers low viscosity, long working time, and excellent flexibility for sealing capacitors and small electronics, improving heat transfer and component lifespan.

One-component room temperature cure silicone adhesive with 2.0W/mK thermal conductivity and UL94 V-0 flame retardancy. Features low shrinkage, excellent electrical insulation, and strong adhesion to metals. Ideal for LED cooling, power modules, and electronic component thermal management applications.

One-component dealcoholized silicone adhesive with 1.2W/mK thermal conductivity and -60 to 250°C operating temperature. Features UL94 V-0 flame retardancy, excellent electrical insulation, and strong adhesion to metals. Ideal for electronics thermal management applications including LED systems, power modules, and semiconductors.

TIS™680-15AB two-component thermal conductive adhesive offers 1.5W/mK thermal conductivity for efficient LED panel light potting. Features 4000 mPa.s viscosity, UL94 V-0 fire resistance, and excellent electrical insulation. Ideal for capacitors, transformers, and electronic device encapsulation with operating range from -40℃ to 160℃.