Thermal Adhesive Tape

3000 Vac voltage breakdown, and replaces thermal grease for LED heat sink mounting, BGA processors, and power converter applications.">High-performance thermally conductive acrylic adhesive tape with 0.8 W/mK thermal conductivity and 0.010" thickness. Features fiberglass reinforcement, >3000 Vac voltage breakdown, and replaces thermal grease for LED heat sink mounting, BGA processors, and power converter applications.

High-performance thermally conductive adhesive tape with 0.9 W/mK thermal conductivity and 5000 VAC dielectric strength. Features 2.2 g/cc specific gravity, UL 94 V0 flame rating, and eliminates need for mechanical fasteners. Ideal for heat sink mounting on processors, LED systems, and power electronics.

Fire resistance thermal acrylic tape TIA610P 1400 g/inch peel adhesion low impedance for replacing heat cure adhesive The TIA610P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. Features >Thermal Conductivity:

Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. Features >Thermal Conductivity: 0.8 W/mK

New products die cutting in round shape thermal adhesive double side tape fire resistance equate 94 V-0​ The TIA™605P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. Features Thermal Conductivity: 0.8 W/mK High

Double Sided Ashesion Acrylic Tape 0.8W/MK Thermal Adhesive Tape For LED Lighting The TIA®800 Series is filled with good thermal conductivity ceramic particles, featuring excellent thermal conductivity, strong adhesion and electrical insulation. It is suitable for bonding and fixing electronic components to heat sinks or housings, such as LED modules, power devices, communication equipment and other scenarios. The product is solvent-free, pollution-free, easy to construct,

High Performance Conductive Acrylic TIA800 Series 0.8W/MK Thermal Adhesive Tape With Double-Sided Adhesive The TIA®800 Series is filled with good thermal conductivity ceramic particles, featuring excellent thermal conductivity, strong adhesion and electrical insulation. It is suitable for bonding and fixing electronic components to heat sinks or housings, such as LED modules, power devices, communication equipment and other scenarios. The product is solvent-free, pollution

Stable Operation Over A Wide Temperature Range White 0.8W/MK Thermal Conductivity Double-Sided Adhesive Tape For Power Device The TIA®804 Series is filled with good thermal conductivity ceramic particles, featuring excellent thermal conductivity, strong adhesion and electrical insulation. It is suitable for bonding and fixing electronic components to heat sinks or housings, such as LED modules, power devices, communication equipment and other scenarios. The product is solvent

High Performance Aluminum Thermal Adhesive Tape For Power Converter PCB Heat Spreader The TIA™800ALSeries products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. Features > Thermal Conductivity: 1.6W/mK > High bond strength

Acrylic Thermal Adhesive Tape For LED Mount Heat Sink Conductive 0.8 W/MK The TIA™805FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. Features > Thermal Conductivity: 0.8 W/mK > High bond strength to a

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. TIA800FG Series Datasheet-(E)-REV01.pdf Features >

Ceramic Filled Silicone Elastomer Thermal Adhesive tape, Thickness 0.1~0.5mmT Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can

High Performance Consumer Electronics White Acrylic Adhesive 0.8W/MK Thermal Adhesive Tape With Double-Sided Adhesive The TIA®806 Series is filled with good thermal conductivity ceramic particles, featuring excellent thermal conductivity, strong adhesion and electrical insulation. It is suitable for bonding and fixing electronic components to heat sinks or housings, such as LED modules, power devices, communication equipment and other scenarios. The product is solvent-free,

High Performance blue Acrylic Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. TIA800FG Series Datasheet-(E)-REV01.pdf Features >

High Bond Strength Blue Acrylic Thermal Adhesive tape 0.8W/MK Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. The TIA™800FG Series products are mostly used for bonding heat

High performance thermally conductive acrylic adhesive tape For LED Mount Heat Sink Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines

Ultra Thin LED Flat Light Thermal Adhesive Tape 0.8 W / mK with Double Sided Adhesive​ The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. TIA800FG Series Datasheet-(E)-REV01.pdf Features > Thermal

Double - Sided Thermal Adhesive Tape , High Voltage Isolation Thermal Conductive Strong Adhesive Tape The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. Features > Thermal Conductivity: 0.8 W/mK >

High-performance thermal adhesive tape featuring 0.8 W/mK conductivity and glass fiber reinforcement. Provides superior bonding strength for heat sinks, processors, and power semiconductors. Replaces thermal grease and mechanical fasteners with multiple thickness options from 0.005" to 0.020" for various thermal management applications.

High-performance thermal conductive adhesive tape with 1.0 W/mK thermal conductivity and superior bonding strength. Fiberglass reinforced with voltage breakdown up to 3500 Vac, ideal for mounting heat sinks to processors and PCBs. Available in multiple thicknesses from 0.005" to 0.020" with custom die-cut options available.