Ziitek TIF015AB-07S is a high-performance thermal conductive putty designed for advanced thermal management in electronic devices. This two-component liquid gap filling material provides excellent heat dissipation with 1.5W/mK thermal conductivity, ensuring optimal performance and extended lifespan for heat-generating components.

• High thermal conductivity: 1.5W/mK for efficient heat transfer
• UL recognized for safety and compliance
• Naturally tacky surface requiring no additional adhesive
• Two-part formulation for easy storage and handling
• High durability and long-term reliability
• Optimized shear thinning characteristics for easy dispensing
• Dry, touchable cured surface unlike traditional greases

• Tablet computers and notebook devices
• Set-top boxes and entertainment systems
• Power box monitoring systems
• High-speed mass storage drives
• Heat sinks for heat-generating semiconductors

Available in standard packaging: 50cc per piece (48 pieces per box) or 400cc per piece (9 pieces per box). Custom syringe packaging for automated dispensing applications is also available upon request.